Description
The Role and Team:
As a Packaging Structure Design Intern, you will be an active member of our global packaging and product design teams, collaborating with experts to create great products across multiple categories.
Your Contribution:
In this role, you will gain hands-on experience in packaging structure design, materials exploration, and printing technologies. You will work alongside industry experts to bring ideas from concept to reality.
Key Responsibilities:
- Immersive Learning: Gain hands-on experience in packaging structure design, materials exploration, and printing technologies.
- Design Systems: Contribute to packaging strategy and specification development, ensuring consistency and efficiency across global projects.
- Storytelling & Content: Craft clear, compelling stories and assets that translate design, sustainability, and innovation into clear, compelling communication for internal and external audiences.
- Material Curation: Help build and maintain our materials library,researching, sourcing, and organizing new packaging materials to support sustainable and innovative design strategies.
- Testing & Validation: Learn and apply packaging test standards to evaluate design solutions, ensuring they meet performance and quality goals.
Key Qualifications:
To be considered for this role, you must bring the following minimum skills and experiences to our team:
- Currently an undergraduate student or within two years of graduation in Industrial Design, Packaging Design, Mechanical Engineering, or a related field.
- Fully proficient in Adobe software, ArtiosCAD and/or 3D modeling. Familiarity with Google Systems (Docs, Sheets, Drive) is essential.
- Basic understanding of packaging structure design, materials, and printing processes.
- A certain level of visual communication, multimedia production and presentation skills
- Strong English skills,both written and verbal,to collaborate effectively with global teams.
Preferred Qualifications:
- Knowledge of packaging test standards and implementation.
- Experience with consumer electronic products is a strong plus.
- A passion for design, eagerness to learn new things and a “just do it” attitude.
Internship Details:
- Summer internship period: July 1, 2026 (Wed) ~ August 31, 2026 (Mon) with the possibility of extension.
This listing is enriched and indexed by YubHub. To apply, use the employer's original posting:
https://logitech.wd5.myworkdayjobs.com/en-US/Logitech/job/Hsinchu-Taiwan/XMLNAME--Summer-Internship--Packaging-Structure-Design-Intern_146419