Senior Packaging Technical Engineer - Hardware

We are seeking a Senior Packaging Technical Engineer to join our team.

Responsibilities include:

• Defining the chip pad ring, substrate interconnect scheme, and leading the package layout design process.
• Collaborating with large teams consisting of Circuit, Signal Integrity, RTL, Place and Route, substrate layout, and system design Engineers and Managers.
• Defining a chip floor plan, pad ring, substrate, and ball out to implement a robust world-class electrical package.
• Communicating effectively with various teams throughout the company.

Requirements:

• BSEE or equivalent experience.
• Minimum of 8+ years in board/system design, with experience in package design preferred.
• Good understanding of transmission line theory, power delivery, and signal integrity.
• Strong programming and scripting skills in Perl, Python, Tcl, and Cadence Skill, with Excel familiarity helpful.
• Ability to work with minimal supervision and enthusiasm for solving complex technical problems.

NVIDIA offers competitive salaries and a generous benefits package.