Manager, Mechanical Engineering

We are looking for an outstanding Mechanical Engineering Manager to join our Networking Thermal Engineering team. In this role, you will lead the development of next-generation cooling and mechanical solutions for high-speed communication systems.

As part of the Networking Thermal Engineering team, you will support a wide range of NVIDIA products, helping address increasing power density challenges through innovative, scalable, and practical engineering solutions.

Key Responsibilities:

• Manage and lead three complementary teams of 15+ Engineers across three complementary teams, including a Mechanical Analysis team covering chip to rack level structural simulations
• Lead the Mechanical Design team developing next-generation thermal/mechanical solution and Materials experts enabling advanced material, TIM, and joining technologies
• Direct a multidisciplinary R&D team engaged in a variety of areas, including mechanical design supporting thermal solutions, mechanical analysis, soldering technologies, materials and manufacturing processes for production lines, etc.
• Support designs of advanced thermal solutions for NVIDIA next generation products, focusing on both liquid cooled and air-cooled thermal solutions.

Requirements:

• M.Sc. in Mechanical Engineering or equivalent degree
• 8+ overall years of experience and at least 4+ years of proven leadership experience managing thermal and mechanical development teams
• Strong experience in mechanical and thermal analysis methodologies
• Proven experience developing advanced thermal solutions, including liquid cooling technologies, from concept through mass production
• Strong understanding of thermo-mechanical challenges in high-power electronic systems
• Experience working across multiple physical scales, from chip level to system level
• Ability to lead multidisciplinary engineering activities and drive execution
• Strong communication skills and ability to work effectively across cross-functional teams.

Nice to Have:

• Liquid cooling scaling challenges
• Advanced TIM / materials direction
• Enabling new technologies
• Balancing innovation with manufacturability
• Chip → rack system thinking