Description
We are now looking for a Senior Packaging Technical Engineer to join our team. As a Senior Packaging Technical Engineer, you will be responsible for defining the chip pad ring, substrate interconnect scheme, and leading the package layout design process. You will collaborate with large teams consisting of Circuit, Signal Integrity, RTL, Place and Route, substrate layout and system design Engineers and Managers. You will also work to define a chip floor plan, pad ring, substrate, and ball out implementing a robust world-class electrical package! Effective communication with various teams throughout the company is essential for this role.
To be successful in this role, you will need to have a BSEE or equivalent experience, with a minimum of 8+ years in board/system design. Experience with package design is preferred. A good understanding of transmission line theory, power delivery and signal integrity is desired. Strong programming and scripting skills in Perl, Python, Tcl are required, with Cadence Skill and EXCEL familiarity being helpful.
If you are enthusiastic and able to work with a minimum of supervision, and seek to solve complex technical problems, then we want to hear from you!