Description
You will work on high-bandwidth memory interfaces like HBM and emerging die-to-die standards, designing and developing analog and mixed-signal circuits in the latest process nodes.
Collaborate with engineers across the globe to figure out the best way to solve tough technical problems in 2.5D and 3D multi-chip designs.
Work directly with customers to help them integrate our IP, troubleshoot issues when things do not behave as expected, and adjust designs to fit real system needs.
Own the silicon-to-simulation correlation work for testchips, figure out why measurements and models do not always agree, and feed those lessons back into the design process.
Partner with layout teams to make sure circuits perform the way they need to, managing parasitics, matching, and all the things that matter when rubber meets road.
Mentor junior engineers on circuit design, layout best practices, debugging strategies, and how to work with customers effectively.
Build scripts and explore AI tools to automate repetitive design tasks and help the team work faster and smarter.
This role requires a strong background in analog and mixed-signal design, with experience in high-speed links, memory interfaces, or multi-chip systems. You should also have good communication skills and be able to work well with people across different teams and time zones.