Interconnect Hardware Engineer - Networking

We are seeking a Development Engineer to join the Interconnect Design team in Roskilde, Denmark. This role focuses on the end-to-end development of high-speed optical transceivers that enable next-generation data center interconnects. You will own complete transceiver developments,shaping technical direction, executing hands-on lab work, and collaborating with a wide range of global partners to bring products from early concept through high-volume manufacturing.

This is a highly technical, hands-on position requiring strong ownership, lab expertise, and a product-oriented mindset.

Responsibilities

• Drive the design, adaptation, and validation of high-speed optical transceivers
• Take technical leadership of development programs from requirements definition to production release
• Collaborate closely with system architects, firmware, optics, mechanical, thermal, manufacturing, and operations teams
• Perform laboratory bring-up, debugging, and optimization of prototypes
• Execute detailed electrical and optical characterization against industry standards
• Support root-cause analysis and performance optimization at both component and system level

Requirements

• Master's degree (or equivalent experience) in Electrical Engineering, Photonics, or a related field
• 3+ years of industry experience working with high-speed optical or digital communication systems
• Hands-on experience with laboratory measurement, validation, and debug of high-speed hardware
• Working knowledge of optoelectronic components and transceiver architectures
• Basic understanding of electronics and RF principles
• Strong sense of ownership with the ability to independently drive projects forward
• Excellent written and spoken English communication skills
• Proficiency in at least one programming or scripting language (e.g., Python, MATLAB)

Nice to Have

• Ph.D in a relevant technical field
• Experience with optical system design or high-speed optical links
• Exposure to electronic or optoelectronic packaging
• Background in PCB or electrical circuit design and EMC/EMI fundamentals
• Familiarity with thermal solutions for high-performance hardware