Description
You are a multidisciplinary engineer with a strong foundation in physics and electromagnetics, and a deep understanding of signal and power integrity challenges in modern electronic designs. You are comfortable bridging theory and practice, translating complex electromagnetic concepts into real-world implementations at the board and system level.
You thrive in an environment where system-level thinking is critical. Whether it’s defining routing strategies, evaluating material choices, or planning power distribution, you take a structured and analytical approach to solving complex problems. You are proactive, detail-oriented, and enjoy collaborating across teams to achieve optimal system performance.
You also bring a mindset of continuous improvement. You leverage automation, scripting, and data analysis to streamline workflows, increase efficiency, and scale engineering processes. You are comfortable working with modern simulation tools and are motivated to expand your expertise in areas such as system-level modeling and advanced packaging.
Conduct feasibility studies for PCB stack-up design and material selection Define routing strategies and fan-out patterns for high-performance systems Plan and analyse power distribution networks at board and system level Assess electronic components and their impact on signal and power integrity Perform signal and power integrity analysis to optimise system performance Collaborate closely with the PCB design team to ensure successful board tape-out Automate simulation, post-processing, and analysis workflows using Python and PyAnsys Use electromagnetic simulation tools and 3D modeling environments to support system integration Support advanced packaging and system-level integration studies Develop scalable and efficient engineering processes through automation and data analysis
Enable the successful design and tape-out of high-performance electronic systems Improve signal and power integrity, ensuring robust and reliable system performance Increase engineering efficiency through automation and scalable workflows Support innovation in next-generation platforms and system architectures Enhance design accuracy and performance at board and system level Drive improvements in integration, simulation, and analysis methodologies