Director, Reliability Hardware System

Our HW team in Israel is looking for a senior system HW Reliability manager to join the HW System qualification Group. The team owns the qualification and validation of networking infrastructure for NVIDIA next-generation data centers focusing on accelerated performance while enabling optimized end-to-end GPU connectivity.

In addition, we serve a wide range of markets including AI, high performance computing, enterprise, data centers, cloud computing, extensive data systems and Web 2.0. We are constantly reinventing ourselves to stay ahead of the market and bring groundbreaking products and services to the industry.

Responsibilities:

• Lead the end-to-end reliability and failure analysis (FA) activities for the entire Networking organization. You will be the primary advocate for product stability and long-term performance.

• Direct multiple system-level teams. Your focus will be on coaching, mentoring, and developing the next generation of engineering managers, conducting performance evaluations, and scaling the organization’s capabilities.

• Act as the reliability "glue" between diverse engineering rigors. You will collaborate closely with Board Build, Mechanics, Thermal, PCB Layout and Production teams to ensure a broad approach to quality.

• Drive high-priority "War Room" investigations for complex, intermittent field failures, using advanced FA techniques to reach definitive root causes.

• Use statistical tools and physics-of-failure models to predict product life cycles and identify potential wear-out mechanisms before they reach the field.

• Influence the product architecture starting from the beginning by driving Build for Reliability (BfR) and Build for Manufacturing (BfM) requirements into the initial hardware specifications. Alternatively, apply equivalent experience.

• Formalize a "Lessons Learned" process where failure analysis results directly inform the design rules for next-generation networking hardware.

Requirements:

• B.Sc. or M.Sc. in Materials Science and Engineering

• 15+ overall years of demonstrated management experience with teams of 10+

• At least 8+ years of management experience

• Ability to multitask many assignments and coordinate testing for numerous programs

• Deep understanding of Physics of Failure and reliability physics related to semiconductors, PCBA, and interconnects (e.g., electromigration, stress-induced voiding, thermal fatigue).

• Hands-on experience with sophisticated Failure Analysis (FA) techniques such as Cross-sectioning, SEM/EDX, CSAM, X-ray, and Dye & Pry to identify root causes at the material and structural level.

• Proficiency in reliability statistics, including Weibull analysis, accelerated life testing, and MTBF modelling.

• Comprehensive knowledge of industry standards such as JEDEC, IPC, and Telcordia for component and system-level qualification.

• Define new processes to improve coverage and overall product quality