Senior Signal Integrity Engineer – Cryogenic Interconnects

We are seeking a Senior Signal Integrity Engineer – Cryogenic Interconnects to join our dynamic team working with state-of-the-art, unique technology.

The successful candidate will develop accurate 3D EM models for PCB and interconnect structures using tools such as HFSS, simulate multi-layer PCB designs under cryogenic conditions, and define high-speed constraints, SI specifications, and design guidelines across RF, materials, and thermal domains.

Responsibilities:

• Develop accurate 3D EM models for PCB and interconnect structures using tools such as HFSS
• Simulate multi-layer PCB designs under cryogenic conditions
• Define high-speed constraints, SI specifications, and design guidelines across RF, materials, and thermal domains
• Work on next-generation cryogenic interconnect solutions for ultra-high-speed communication
• Collaborate closely with SI, materials, mixed-signal, and system teams to drive end-to-end interconnect performance
• Perform lab characterization and validation using network analyzers and other measurement tools
• Correlate simulation results with hardware measurements to improve modeling accuracy
• Contribute to system-level understanding of interconnect behavior across PCB, package, and system domains

Requirements:

• MS/PhD in Electrical Engineering or equivalent experience
• 5+ years of experience
• Strong experience in signal integrity modeling and simulation (HFSS or similar EM tools)
• Deep understanding of high-frequency / broadband design
• Solid understanding of multi-layer PCB design and signal behavior
• Knowledge of PCB materials and their electrical and physical properties
• Experience with lab measurements (VNA, high-speed characterization)
• Background in cryogenic technologies or strong interest in developing expertise in this area

Nice to Have:

• Experience working on low-loss / ultra-high-speed interconnects
• Background in materials modeling or SI-material correlation
• Experience in extreme environments (cryogenic, thermal, or reliability-driven design)
• Track record of correlating simulation to hardware measurements
• Strong cross-functional experience with PCB, package, and system teams

You will also be eligible for equity and benefits.