Lead PCB Design Engineer

As the world enters an era of strategic competition, Anduril is committed to bringing cutting-edge autonomy, AI, computer vision, sensor fusion, and networking technology to the military in months, not years.

We are seeking a Lead PCB Design Engineer to join our team. In this role, you will work directly with engineers to produce printed circuit board designs supporting Anduril's products. You will apply modern design standards and guidelines to create high-reliability, highly manufacturable assemblies.

Key Responsibilities:

• Work directly with engineers to produce printed circuit board designs supporting Anduril's products.
• Apply modern design standards and guidelines to create high-reliability, highly manufacturable assemblies.
• Implement combinations of high-speed digital, precision analog, RF, and high-power designs.
• Lead the team in establishing internal guidelines for design for manufacturing (DFM), design for assembly (DFA), and overall quality fabrication and assembly outputs.
• Develop and refine team processes for PCB design, part creation, and library/database standards.
• Coordinate external PCB design resources during design surges.
• Work in a fast-paced environment, having to juggle multiple concurrent projects and customers.

Requirements:

• Bachelor's degree in electrical engineering or similar and 4+ years of professional experience in PCB design.
• Ability to read and interpret schematics and apply best practices appropriate for each design.
• Expertise in applying relevant IPC standards, CID, CID+ certification.
• Expertise in PCB fabrication processes, limitations, design rules, and best practice.
• Experience using Altium Designer CAD tools (Allegro is a plus).
• Experience with developing component libraries and library management.
• Excellent communication skills with multiple fab houses (ensuring boards are built to print).
• Excellent communication skills with multiple assembly houses (ensuring boards are built to BOM).
• Experience with a variety of board types, including high density and high layer count (greater than 16) digital designs, power electronics, flex circuits, and RF circuits.
• Experience with HDI (high density interconnect) and thicker boards (greater than 1.6mm).
• Experience with high speed digital interfaces and controlled impedance routing requirements like USB, PCIe, Ethernet, SERDES, and DDR memory.
• Eligible to obtain and maintain an active U.S. Secret security clearance.

Preferred Qualifications:

• Familiar with RF board design.
• Experience with high-pin count packages (FPGA fanout).
• Familiar with basic signal and power integrity rules (how they affect layout).

Salary Range: $191,000-$253,000 USD