Description
We are now looking for a Senior Power Integrity Engineer to join our LPU Packaging team. As a Senior Power Integrity Engineer, you will be responsible for defining best-in-class power delivery design and optimization practices from die/package through board, tray, and rack levels for the full product development cycle.
Your key responsibilities will include:
- Defining PDN targets including impedance, droop, noise, and transient response for GPU, HBM, and high-speed SerDes
- Architecting package-level PDNs by collaborating with design teams on bump/ball maps, via structures, and decoupling strategies for FCBGA and 25D/3D integrations
- Driving system-level PI design, including board-level PDN planning, decap placement, and VRM interfaces while co-optimizing with SI, thermal, and mechanical teams
- Performing PI extraction and simulation for advanced packages and developing integrated chip–package–board co-simulation flows using industry-standard tools
- Generating and deploying reusable PI models, such as SPICE, S-parameter, and IBIS-AMI, for use by internal and external partners
- Defining and executing comprehensive lab validation plans to correlate measured impedance, noise, and droop against simulation data and specifications
- Debugging complex system-level issues including rail noise, jitter-induced errors, resets, and margin loss during hardware testing and validation
To be successful in this role, you will need:
- MS or PhD in Electrical Engineering or a related field, or equivalent experience
- 12+ years of relevant work experience in Power Integrity
- A strong background in power integrity for high-current, low-voltage rails within large GPUs, ASICs, or CPUs
- Proven ownership of the chip-package-board PDN design and sign-off process
- Hands-on experience with FCBGA, 25D/3D integration, HBM, or similar high-power, high-pin-count packages
- Direct experience in the co-design of bump/ball maps, power/ground planes, and decoupling capacitor networks
- Proficiency with frequency-domain PDN impedance analysis and time-domain transient/droop simulation tools (e.g., PowerSI, PowerDC, Sigrity, RedHawk, Totem, HFSS, SIwave, ADS, or SPICE)
- A deep understanding of board-level PDN design, including stack-up definition, plane partitioning, and VRM placement on high-layer-count accelerator boards
- Experience in executing lab measurements using VNAs, oscilloscopes, and PDN analyzers to correlate measured noise and droop to original specifications
If you have a passion for power integrity and a strong background in electrical engineering, we encourage you to apply for this exciting opportunity.
This listing is enriched and indexed by YubHub. To apply, use the employer's original posting:
https://nvidia.wd5.myworkdayjobs.com/en-US/NVIDIAExternalCareerSite/job/US-CA-Santa-Clara/Senior-Power-Integrity-Engineer---LPU-Packaging_JR2014374