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NVIDIA

Senior Power Integrity Engineer - LPU Packaging

NVIDIA
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onsite senior full-time $95,000–$150,000 Santa Clara

First indexed 18 May 2026

Description

We are now looking for a Senior Power Integrity Engineer to join our LPU Packaging team. As a Senior Power Integrity Engineer, you will be responsible for defining best-in-class power delivery design and optimization practices from die/package through board, tray, and rack levels for the full product development cycle.

Your key responsibilities will include:

  • Defining PDN targets including impedance, droop, noise, and transient response for GPU, HBM, and high-speed SerDes
  • Architecting package-level PDNs by collaborating with design teams on bump/ball maps, via structures, and decoupling strategies for FCBGA and 25D/3D integrations
  • Driving system-level PI design, including board-level PDN planning, decap placement, and VRM interfaces while co-optimizing with SI, thermal, and mechanical teams
  • Performing PI extraction and simulation for advanced packages and developing integrated chip–package–board co-simulation flows using industry-standard tools
  • Generating and deploying reusable PI models, such as SPICE, S-parameter, and IBIS-AMI, for use by internal and external partners
  • Defining and executing comprehensive lab validation plans to correlate measured impedance, noise, and droop against simulation data and specifications
  • Debugging complex system-level issues including rail noise, jitter-induced errors, resets, and margin loss during hardware testing and validation

To be successful in this role, you will need:

  • MS or PhD in Electrical Engineering or a related field, or equivalent experience
  • 12+ years of relevant work experience in Power Integrity
  • A strong background in power integrity for high-current, low-voltage rails within large GPUs, ASICs, or CPUs
  • Proven ownership of the chip-package-board PDN design and sign-off process
  • Hands-on experience with FCBGA, 25D/3D integration, HBM, or similar high-power, high-pin-count packages
  • Direct experience in the co-design of bump/ball maps, power/ground planes, and decoupling capacitor networks
  • Proficiency with frequency-domain PDN impedance analysis and time-domain transient/droop simulation tools (e.g., PowerSI, PowerDC, Sigrity, RedHawk, Totem, HFSS, SIwave, ADS, or SPICE)
  • A deep understanding of board-level PDN design, including stack-up definition, plane partitioning, and VRM placement on high-layer-count accelerator boards
  • Experience in executing lab measurements using VNAs, oscilloscopes, and PDN analyzers to correlate measured noise and droop to original specifications

If you have a passion for power integrity and a strong background in electrical engineering, we encourage you to apply for this exciting opportunity.