Description
We Are:
At Synopsys, we drive the innovations that shape the way we live and connect. Our technology is central to the Era of Pervasive Intelligence, from self-driving cars to learning machines. We lead in chip design, verification, and IP integration, empowering the creation of high-performance silicon chips and software content. Join us to transform the future through continuous technological innovation.
You Are:
You are a seasoned semiconductor leader with deep expertise in IC design and advanced packaging, including 3DIC technologies. You have successfully led complex, cross-functional organisations and delivered differentiated silicon IP solutions from concept to execution.
You bring a strong strategic mindset, combining technical depth with a clear understanding of market dynamics and customer needs. You are known for translating complex technical challenges into actionable plans and for influencing across engineering, product, go-to-market, and customer-facing teams in a highly matrixed, global environment.
You inspire, develop, and empower high-performing teams. You foster a culture of collaboration, accountability, and continuous improvement, and you lead with credibility, clarity, and purpose to consistently exceed business and customer expectations.
What You'll Be Doing:
- Leading 3DIC silicon IP and advanced packaging design and verification across layout, physical design, signal integrity, power integrity, thermal modelling management, and mechanical integrity for AI infrastructure and high-performance computing products.
- Managing cross-functional collaboration with EDA tool development, Go-To-Market strategies, and Customer Success in utilizing Synopsys solutions.
- Keeping track of industry trends in the fast-changing field of 3DIC and semiconductor packaging to drive new product innovations.
- Ensuring developed solutions are in alignment with business objectives while delivering differentiated technical solutions.
- Embodying a collaborative, supportive, and inspirational leadership style to deliver results that exceed expectations.
- Comfortable in a matrixed, international, team-oriented environment with multiple stakeholders.
The Impact You Will Have:
- Driving the strategic technology development, planning, and execution of Silicon IP for 3DIC and advanced packaging solutions.
- Influencing and shaping the direction of Synopsys' product offerings in the semiconductor industry.
- Playing a key role in advancing Synopsys' 3DIC and advanced packaging leadership by contributing to the company's long-term technology roadmap.
- Enhancing customer satisfaction by delivering state-of-the-art solutions that meet their needs.
- Contributing to the overall success and growth of Synopsys by leading high-impact projects.
- Fostering a culture of excellence and continuous improvement within your team.
What You'll Need:
?B.S./M.S. in Electrical Engineering or a related technical discipline, or equivalent professional experience.
- 15+ years of experience in the semiconductor industry, with demonstrated depth in advanced packaging and 3DIC technologies.
- Deep hands-on and organisational expertise in 3DIC architectures, including chiplets, heterogeneous integration, and die-to-die interconnects.
- Strong command of 3DIC-specific design and signoff challenges, including signal and power integrity, thermal behaviour, mechanical stress, reliability, and yield.
- Experience building, leading, and scaling large, multi-site engineering teams, delivering complex 3DIC technologies from architecture through production.
- Ability to drive end-to-end silicon IP execution, making sound tradeoffs across performance, power, area, cost, and manufacturability.
- Capability to define technical vision and long-term roadmap for 3DIC and advanced packaging, aligned with business strategy.
- Effectiveness in influencing across functions, partnering with EDA, product management, go-to-market, manufacturing, and customer success teams in a matrixed environment.
- Strong customer-facing leadership, including direct engagement with leading customers and ecosystem partners to shape requirements and drive adoption.
- A customer-centric mindset, strong execution discipline, and commitment to innovation and continuous improvement.