Staff Application Engineer (Electronics Thermal Management)

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What you'll do

Our Hardware Engineers at Synopsys are responsible for designing and developing cutting-edge semiconductor solutions. They work on intricate tasks such as chip architecture, circuit design, and verification to ensure the efficiency and reliability of semiconductor products. These engineers play a crucial role in advancing technology and enabling innovations in various industries.

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Job Description

Date posted 12/14/2025

Category EngineeringHire Type EmployeeJob ID 13730Base Salary Range $112000-$168000Remote Eligible NoDate Posted 12/14/2025

What you'll do

• Lead and coordinate all technical activities throughout the sales opportunity lifecycle, including technical discovery, product presentations, demonstrations, and evaluations.
• Engage directly with customers to understand their product design needs and engineering workflows, providing expert guidance on leveraging Ansys simulation solutions for electronics thermal management.
• Develop and deploy differentiating simulation solutions using the Ansys platform, integrating them seamlessly into customer design processes.
• Serve as a subject matter expert, deepening your industry knowledge and providing guidance to both customers and internal teams.
• Collaborate with product development teams to translate customer requirements into innovative product features and best practices
• Test rigorously new Ansys product releases on real-world industrial problems and contribute to the creation of application best practices.
• Support field and digital marketing initiatives, authoring conference presentations and technical content and thought leadership within the electronics thermal domain
• Provide consulting services and conduct training classes for customers, enabling them to maximize the value of Ansys solutions.
• Travel domestically to customer sites, conferences, and industry events to provide hands-on support and build lasting relationships (up to 25%, with flexibility for up to 50%).

What you need

• MS in Mechanical Engineering or a related field (BS+5, MS+3, or PhD+0 years of experience in engineering software environments).
• Strong background in fluid mechanics and computational fluid dynamics (CFD)and thermodynamics with practical application in the electronics industry.
• Demonstrated proficiency with Ansys software (Fluent, Icepak, Mechanical) or similar CAE, CAD, EDA, or PLM tools.
• Experience integrating simulation solutions into customer design workflows at the package, board, and system level.
• Familiarity with Multiphysics simulation approaches (e.g., Electro-Thermal, Thermo-Mechanical) is highly desirable.
• Excellent interpersonal, verbal, and written communication skills and comfort with effective interaction with senior business managers and C-level executives.
• Willingness and ability to travel domestically up to 25% (potentially up to 50%).