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From the employer's careers site First seen 1 Nov 2026 · Still live on 5 Nov 2026

Thermal/Mechanical Engineering Intern

Salary

Hourly Salary USD 35.00 - 41.00

Apply on Hewlett Packard Enterprise

Description

We are seeking a motivated Thermal/Mechanical Engineering Intern to support the design, analysis, testing, and validation of next-generation server hardware.

Working alongside experienced mechanical, thermal, electrical, firmware, and system engineers, the intern will help develop reliable cooling and mechanical solutions for compute-intensive platforms containing CPUs, GPUs, memory, storage, power supplies, and high-speed I/O devices.

Responsibilities:

  • Support the mechanical and thermal development of rack-mount server platforms, subsystems, and components.
  • Assist with the design and evaluation of heat sinks, fans, air ducts, cold plates, brackets, sheet-metal parts, and other cooling or structural hardware.
  • Build and instrument server prototypes for thermal, airflow, acoustic, vibration, and mechanical testing.
  • Measure component temperatures, system airflow, pressure, power, and environmental conditions using laboratory equipment and data-acquisition tools.
  • Execute documented test plans, maintain accurate test records, analyze results, and summarize findings in clear technical reports.
  • Support workload and stress testing of CPUs, GPUs, DIMMs, drives, power supplies, and other heat-generating components.
  • Perform engineering calculations and assist with CAD, tolerance analysis, thermal modeling, CFD, or FEA under the guidance of senior engineers.
  • Investigate test anomalies and prototype issues using structured troubleshooting and root-cause methods.
  • Participate in design reviews and collaborate with electrical, firmware, manufacturing, reliability, and supplier teams.
  • Research emerging server-cooling technologies, materials, and design practices, including air cooling and direct liquid cooling.
  • Follow laboratory safety procedures, maintain an organized workspace, and contribute to continuous improvement of test methods and documentation.

Education & Experience:

  • Currently pursuing a bachelor's or master's degree in Mechanical Engineering, Aerospace Engineering, or a related technical field.

Knowledge & Skills:

  • Completed coursework in heat transfer, thermodynamics, fluid mechanics, statics, mechanics of materials, or mechanical design.
  • Fundamental understanding of conduction, convection, pressure drop, airflow, and mechanical load paths.
  • Ability to apply engineering principles to practical problems and communicate results clearly.
  • Basic proficiency with spreadsheets and technical presentations.
  • Strong attention to detail, organization, curiosity, and willingness to work hands-on in a laboratory environment.
  • Ability to collaborate effectively in a multidisciplinary engineering team.

Benefits:

  • Comprehensive suite of benefits that supports physical, financial, and emotional wellbeing.
  • Investment in career development and growth.
  • Unconditional inclusion and celebration of individual uniqueness.

Skills

Required

Apply on Hewlett Packard Enterprise