Description
This is a hybrid role with three days per week at our Holmdel, NJ office.
As a member of the Photonic Integrated Circuit (PIC) team, you will design, simulate, lay out, and characterize integrated photonic components and circuits for high-speed optical communication systems.
Your responsibilities will include:
- Designing passive and active integrated photonic components and circuits, including high-speed optoelectronic devices
- Developing and validating numerical models using electromagnetic, optical, electrical, thermal, and multiphysics simulation methods
- Creating parameterized and script-based GDS layouts for photonic components, integrated circuits, and full product chips
- Supporting photonic design reviews, foundry process development, mask preparation, design-rule verification, and production tapeouts
- Planning and performing hands-on characterization of photonic components and circuits at the die, wafer, and assembled-device levels
- Analyzing measurement data and correlating experimental results with device models, process variations, packaging effects, and system-level performance
- Working with cross-functional teams to transition PIC designs from prototype development into qualified commercial products
- Providing technical support during product integration, qualification, manufacturing ramp, and volume production
The PIC team develops advanced photonic chips for optical communication products, working across silicon photonics, thin-film lithium niobate, and III–V material platforms.
Minimum Qualifications:
- Bachelors + 8 years of related experience, or Masters + 6 years of related experience, or PhD + 3 years of related work experience, or equivalent related work experience
- Experience in solid-state physics, integrated photonics, optoelectronics, and electromagnetic theory
- Experience with the principles and practical application of numerical methods for photonic-device simulation
- Experience using simulation tools such as FDTD, HFSS, COMSOL Multiphysics, or equivalent electromagnetic and multiphysics platforms
- Experience with photonic-device fabrication processes and the relationship between fabrication tolerances and device performance
- Experience with photonic-device layout, GDS generation, design-rule compliance, and tapeout
Preferred Qualifications:
- PhD with at least 5 years of relevant industry or applied research experience
- Experience executing large-scale photonic integrated circuit tapeouts through commercial foundries
- Experience designing and testing PICs for optical transceivers or high-speed optical interconnect systems
- Experience designing, simulating, and characterizing high-speed optical modulators, photodetectors, or related optoelectronic devices
- Experience with high-speed electronic-photonic co-design, including the interaction among device bandwidth, impedance, parasitics, packaging, and signal integrity
- Experience integrating multiple material platforms, including silicon photonics, TFLN, III–V semiconductors, or other hybrid photonic technologies
- Hands-on experience with optical component characterization, including wafer-level and die-level testing
- Experience analyzing device yield, process variation, reliability, and manufacturing-test data
- Experience with scripting or programming languages used for simulation automation, layout generation, test automation, and data analysis
The starting salary range posted for this position is $171,600.00 to $245,000.00 and reflects the projected salary range for new hires in this position in U.S. and/or Canada locations, not including incentive compensation*, equity, or benefits.