Description
We are seeking a highly motivated RDSS Intern in the field of Electrical Failure Analysis to join our electro-optical FA team in Hsinchu, Taiwan.
As an intern, you will perform electro-optical failure analysis, including Photon-Emission, Laser-Voltage-Probing, and Soft-Defect-Localization (SDL, LADA), to support product development, design-debug, yield-ramp, reliability, and customer return analysis of advanced flip chip devices.
Responsibilities:
- Perform electro-optical failure analysis to identify the root cause of failures
- Use CAD layout tools for in-chip navigation and circuit simulation tools to aid analysis
- Set up test-loops within our Advantest 93k tester SW
- Collaborate with multi-functional teams, including Design for Test, Test-Engineers, and Product-Engineers
- Present and explain your results to guide team and PFA efforts
- Support Die Probe Package second-source development for A16 FA readiness
Requirements:
- Master's or PhD degree in Electrical/Computer Engineering or related field
- Basic understanding of DFT for large-scale logical test
- Experience working in a lab, setting up and debugging test environments
- Knowledge of CAD layout tools, logic circuit simulation tools, and Unix operating system
- Good written and verbal communication skills