Description
You will be part of Cisco's Technology and Quality Group in Supply Chain Operations, contributing to the development, road-mapping, and implementation of sophisticated end-to-end thermal solutions for Cisco's products.
Responsibilities:
- Develop and lead system thermal technology roadmap in partnership with suppliers and internal partners to meet Cisco products' needs.
- Develop quality strategy for liquid cooling manufacturing process.
- Investigate innovative liquid cooling solutions for hardware systems in large scale.
- Derive tradeoffs in thermal performance of different package design elements and chip thermal gradients from experimental test data.
- Develop test plans and qualification requirements to ensure mechanical and manufacturing adaptability of thermal cooling solutions.
- Engage with external vendors on design, test, and production.
- Develop and publish case studies/technical papers describing thermal analysis of cooling systems.
- Establish parameters for thermal design/testing, correlation of design/test results to model predictions.
- Contribute to analytical and numerical models using Computational Fluid Dynamics tools.
- Drive supplier ecosystem development, participate in industry consortia, conferences, and collaborate with academia and strategic partners.
- Integrate Circuit Thermal simulation and testing and system level cooling technologies.
- Mechanical design validation and testing for electronic assemblies.
- Coordinate Circuit Packaging technologies.
- Component and system reliability analysis.
Requirements:
- BS in Mechanical/Thermal or Chemical Engineering.
- 10+ years' experience in design, simulation, and testing of thermal solutions for electronic devices and systems.
- Extensive experience with advanced air-cooling technologies.
- Experience with liquid cooling and/or immersion cooling.
Preferred Qualifications:
- MS or PhD in Mechanical or Chemical Engineering or related field.
- 15+ years of relevant proven experience in microelectronics thermal cooling.
- Experience with JEDEC JESD 51 thermal testing standards.
- Experience with Thermal Interface Material Thermal Conductivity Testing procedures and microelectronics packaging design and manufacturing process.