Description
This is a hybrid role that can be performed three days per week from our Ottawa office.
Acacia, a part of Cisco, designs intelligent transceivers using advanced signal processing and photonic integration for high-speed fibre optic transmission markets. You will work with other Acacia mixed-signal engineers to collaborate on an optimised design that integrates into the ASIC. Additionally, you will have the opportunity to interact with other Acacia groups, including digital/DSP design, system design, package design, and module design.
As a senior member of the Mixed Signal Design team, you will be a key member of a small, dynamic IC Design group that develops high-speed, high-accuracy analog designs for optical communications products. You will architect, design, layout, measure, and productize ultra-deep sub-micron-based CMOS products.
Responsibilities:
- Lead efforts for a large block on a complex chip, mentor team members, track deliverables, participate in peer review of complex IC designs, and provide solid design methodology from conception to production.
- Collaborate with packaging and hardware design teams to ensure signal and power integrity specifications are met.
- Develop high-speed AMS circuits and best-in-class products that push the boundaries of what is possible.
- Work in a team-oriented collaboration approach, enjoying learning from colleagues and letting them learn from you.
Minimum Qualifications:
- Bachelor's degree + 12 years of related experience, or Master's degree + 8 years of related experience, or PhD + 5 years of related experience.
- Prior experience in the design, simulation, and measurement of high-speed ICs across at least three of the following areas: SerDes/serial links, output drivers, Phase Locked Loops (PLLs), clock distribution, Opamps/PGAs, or equalization techniques.
Preferred Qualifications:
- Experience with electrical transceiver applications, including backplane and cable communications.
- Experience in FinFET and GAA technologies.
- High-frequency layout experience, including floorplanning, power/ground, digital/analog signal routing, passives components.
- Experience in design for manufacturability, including characterization over PVT, electromigration analysis, self-heating, and IR drop analysis.
- Experience in laboratory validation, including ESD practices/methodology and construction of test setups.
- Experience in design software, including Cadence (Virtuoso), Spectre/APS/SpectreX, layout validation tools (Virtuoso and Calibre), EMX, mixed-signal simulations in AMS, and Matlab.