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From the employer's careers site First seen 25 Oct 2026 · Still live on 31 Oct 2026

Thermal Engineer

Hewlett Packard Enterprise Taipei On-site mid full-time

The employer hasn't listed a salary.

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Description

We are seeking a Thermal Engineer to join our team in Taipei. As a Thermal Engineer, you will design, analyze, develop, modify, and evaluate materials, mechanical systems, equipment, and packaging.

Responsibilities:

  • Design engineering solutions for mechanical and thermal hardware, electronics enclosures, and production tooling
  • Develop and implement parameters and test plans for new and existing designs
  • Collaborate and communicate with management, internal, and outsourced development partners
  • Lead a project team of other mechanical hardware engineers and internal and outsourced development partners
  • Represent the mechanical/thermal team for all phases of larger and more-complex development projects
  • Provide guidance and mentoring to less-experienced staff members

Requirements:

  • Bachelor's or Master's degree in Mechanical Engineering
  • Typically 4-6 years experience
  • Using ProEngineer or other 3D CAD software as a mechanical design tool
  • Strong analytical and problem-solving skills
  • Strong understanding and experience in electronics packaging
  • Designing sheet metal and plastic parts and associated production tooling and processes
  • Using CFD and thermal mockups to validate thermal solution
  • Excellent written and verbal communication skills

Skills

Required

  • ProEngineer
  • 3D CAD
  • mechanical design
  • analytical skills
  • problem-solving skills
  • electronics packaging
  • CFD
  • thermal mockups
  • communication skills

Ready to apply?

You apply with the employer directly. Their original posting is here: https://hpe.wd5.myworkdayjobs.com/en-US/Jobsathpe/job/Taipei-Taipei-City-Taiwan/Thermal-Engineer_1215499-2

Apply on Hewlett Packard Enterprise