Principal Mechanical Engineer

We are seeking a Principal Mechanical Engineer to join our team in Sunnyvale, California. As a hands-on individual contributor, you will be responsible for the mechanical design, structural analysis, development, and qualification of complex networking systems from concept through production.

Responsibilities include:

• Developing and owning structural FEA simulation capabilities to support multiple ongoing NPI projects as well as sustaining issues as they arise
• Improving simulation accuracy continuously through test correlation and model refinement
• Maintaining and coordinating multiple FEA projects done by yourself, other internal functions, as well as external partners
• Driving and reviewing FEA simulation efforts by component suppliers and ODMs
• Participating from Concept phase to provide design guidance by running FEA studies on areas of concern
• Acting as the main point of contact for all mechanical-related issues that arise from MDVT and HALT and leading issue resolution by validating design changes through simulation and/or test
• Designing and prototyping chassis and fixtures for testing
• Becoming the in-house expert in strain gauge applications and accelerometer measurements during MDVT and HALT
• Conducting thorough processing and analysis of test data including microstrain, G-levels, and ASIC temperatures throughout MDVT and HALT
• Documenting tests and FEA simulations, including static loading, modal analysis, and dynamic, in each NPI project's design review and being responsible for the system's structural integrity
• Communicating recommended design changes effectively to HW leads with strong justification backed by FEA model results
• Collaborating with ASIC development team to generate 3D models of ASICs based on package outline drawings including BGAs and conducting near-package or co-package connector placement and floorplan studies as required
• Supporting manufacturing and operations' efforts to improve production yield by performing FEA studies or running limited design of experiments in lab
• Providing mechanical design and structural analysis support across multiple product development programs, including chassis design, packaging, reliability, and manufacturability
• Participating in hands-on engineering activities, including CAD design and reviews, tolerance analysis, prototyping, testing, and root-cause investigations
• Collaborating with cross-functional teams and suppliers to identify technical risks, resolve design and manufacturing issues, and implement corrective actions
• Contributing to mechanical specifications, design guidelines, validation plans, and engineering best practices
• Providing project scoping, resource estimates, schedule input, and technical guidance for new product development efforts

Requirements:

• 10+ years of experience in electromechanical product development
• MS in Mechanical Engineering, Applied Physics, or equivalent
• Experience developing networking, server, storage, telecommunications, or high-performance computing systems
• Extensive experience with chassis development, system packaging, and high-density electronic assemblies
• Experience in FEA and familiarity with ANSYS Workbench, including static-structural, modal analysis, transient mode superposition, Eigenvalue-Buckling, and steady-state thermal
• Strong hands-on experience with tolerance analysis, GD&T, stack-up analysis, and structural analysis techniques

Expected Competencies:

• Expert-level proficiency with 3D solid modeling tools; SolidWorks experience preferred
• Working knowledge of EPDM or equivalent PLM systems is a plus
• Experience in LS-Dyna and response spectrum analysis are highly desired but not necessary
• Experience in meshing sheet metal geometries as solid or as shell elements and working knowledge of defeaturing non-structural elements to simplify mesh
• Good structural intuition of load path in a mechanical design
• Strong and proven ability to break complex system design down to a sub-system in order to simplify FEA setup and runtime
• Familiarity with test standards including GR-63, IPC-9704, and ASTM D4169
• Strong working knowledge of Young's modulus (E) and coefficients of thermal expansion (CTEs) of common materials used in ASIC and cooling components
• Experience in modeling of die warpage due to thermal effects and with heatsink loading is highly desired
• Previous training with strain gauge applications on PCB and data analysis involving principal microstrain, as well as strain rate, is highly desired
• Experience with accelerometer G-value data filtering and analysis from dynamic tests such as vibration and shock
• Proven hands-on experience in dynamic testing
• Knowledge of dye-and-pry, Shadowmoire, operation of 3D-scanning metrology equipment
• Extensive experience developing complex chassis and system-level mechanical designs for networking, server, storage, or telecommunications products
• Experience with ECAD-MCAD integration and IDF workflows
• Deep understanding of sheet metal design, machining, castings, extrusions, plastics, and associated manufacturing processes
• Strong understanding of tooling requirements and manufacturing considerations for volume production
• Strong understanding of NEBS, EMI, EMC, Safety, and other regulatory compliance requirements
• Proven ability to troubleshoot complex system-level mechanical issues in laboratory, manufacturing, and field environments
• Experience leading root-cause investigations and implementing corrective actions
• Excellent communication and leadership skills with the ability to influence cross-functional teams
• Comprehensive understanding of the complete product development lifecycle from concept through production and field support