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From the employer's careers site First seen 28 Oct 2026 · Still live on 31 Oct 2026

Printed Circuit Board (PCB) Layout Engineer

The employer hasn't listed a salary.

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Description

We are seeking an experienced Printed Circuit Board (PCB) Layout Engineer to design complex printed circuit boards (PCBs) for high-performance computing systems. The PCB Design Engineer will work independently to lay out and help release cutting-edge, high-speed PCBs into production.

Responsibilities:

  • Design printed circuit board layouts using computer-aided design software, consistent with electrical engineering circuit-performance, signal-integrity, and EMI specifications; mechanical engineering form factor and thermal requirements; and manufacturing requirements.
  • Read and interpret schematics, system functionality and performance specifications, and company PCB design guidelines as necessary to complete printed circuit board layouts.
  • Determine PCB design approaches and parameters.
  • Influence design decisions related to the analysis and resolution of system-performance issues associated with printed circuit board layout.

Education and Experience:

  • Associate degree or equivalent technical degree with 10+ years of experience laying out complex, multilayer, high-speed printed circuit boards.
  • Bachelor’s degree in Electrical Engineering or equivalent technical degree with 4+ years of experience laying out complex, multilayer, high-speed printed circuit boards.
  • Advanced knowledge of ECAD software, particularly Cadence Allegro PCB Editor required.
  • Advanced knowledge of PCB design guidelines and design constraints.
  • Experience performing layout studies, determining component placement, and helping drive sound architectural decisions.
  • Experience laying out boards with DDR4 or newer, PCIe Gen 4 or newer, high-speed SerDes, Ethernet, I²C, SPI, and similar interfaces.
  • Experience with high-speed routing techniques, such as microvias, blind and buried vias, and backdrilling.
  • Experience working with PCB fabrication shops and PCA contract manufacturers.
  • Experience with liquid-cooled designs is a plus.
  • Experience helping define ASIC package ball maps is a plus.
  • Experience with industry-standard form factors, such as PCIe CEM and Open Compute Project, is a plus.
  • Experience creating symbols and managing symbol libraries is a plus.

Knowledge and Skills:

  • Ability to read and interpret schematics, datasheets, and layout guidelines.
  • Ability to work with,and, when necessary, lead,engagements with design partners, including electrical engineers, mechanical engineers, signal-integrity and power-integrity engineers, and others.
  • Working knowledge of electronics, including signal- and power-integrity issues.
  • Understanding of EMC principles and best practices for mitigating EMI.
  • In-depth knowledge of Design for Manufacturing (DFM) and Design for Test (DFT) principles.
  • Ability to work independently with loosely defined parameters and perform conceptual analysis.
  • Ability to work successfully with engineers across various geographies to meet design requirements and schedules.
  • Ability to manage multiple board designs simultaneously.
  • Excellent written and verbal communication skills.

Skills

Required

  • ECAD software
  • Cadence Allegro PCB Editor
  • PCB design guidelines
  • high-speed routing techniques
  • microvias
  • blind and buried vias
  • backdrilling
  • PCB fabrication shops
  • PCA contract manufacturers

Nice to have

  • liquid-cooled designs
  • ASIC package ball maps
  • industry-standard form factors
  • PCIe CEM
  • Open Compute Project
  • symbol libraries
Apply on Hewlett Packard Enterprise