Description
This role offers a unique opportunity to make a significant impact on the future of networking innovation within the Cisco Silicon One initiative. As a technical and team leader, you will drive complex package design programs,from planning and optimization to execution,ensuring the delivery of high-speed, robust, and scalable solutions for global networks.
You will lead and mentor engineers and develop future package leads while collaborating closely with layout, SI/PI, silicon architecture, and manufacturing partners. Your leadership will ensure the delivery of high-quality package designs aligned with system-level requirements.
Beyond technical leadership, you will help shape methodologies, improve development flows, and strengthen cross-functional collaboration across Cisco’s global silicon organization, while fostering a culture of collaboration, accountability, and continuous improvement.
Key responsibilities:
- Lead complex package design programs, planning and driving schedules from concept through implementation and tapeout.
- Optimize package pinouts, stack-ups, power distribution, and high-speed routing, balancing performance, manufacturability, and reliability.
- Collaborate with silicon floor planning, signal integrity (SI), and power integrity (PI) teams to ensure design quality and system-level alignment.
- Work closely with layout editors and implementation teams to deliver high-quality package layouts aligned with interface and manufacturing requirements.
- Serve as the technical and organizational lead of the San Jose package design team, providing mentorship, and technical guidance to engineers.
- Develop and grow package design capability within the team, mentoring engineers and enabling them to take ownership of increasingly complex package programs.
- Coordinate resources across designers, layout editors, and contractors to support efficient project execution.
- Enhance package design methodologies and partner with vendors to improve product quality and efficiency.
- Drive innovation in package solutions for Cisco’s next-generation ASIC platforms.
Minimum qualifications:
- Bachelor’s degree in electrical engineering or a related field with 8+ years of relevant work experience or Master’s degree in Electrical Engineering or a related field with 6+ years of relevant work experience.
- Experience in high-speed package design, including signal integrity considerations and power distribution networks (PDN).
- Experience with industry-standard EDA tools for package layout and design.
- Experience with technical leadership in complex hardware or silicon development programs.
Preferred qualifications:
- Experience in ASIC package design, including pinout optimization and high-speed routing.
- Experience with silicon floor planning and collaboration with SI and PI teams.
- Experience leading or mentoring engineering teams and developing engineers.
- Experience coordinating complex cross-functional hardware development programs.
- Experience with testing and measurement equipment (oscilloscopes, TDR/VNA analyzers).
- Experience with scripting languages such as Python, Perl, TCL, or shell programming.
The starting salary range posted for this position is $186,900.00 to $267,700.00 and reflects the projected salary range for new hires in this position in U.S. and/or Canada locations, not including incentive compensation*, equity, or benefits.