Description
The Optics Operations Product Engineering team at Cisco partners with cross-functional teams to design and sustain Optical transceiver components and modules throughout their product lifecycle. As a Product Engineer, you will be responsible for collaborating with engineering teams to provide feedback on DFM and Failure Mode and Effects Analysis (PFMEA), partnering with quality teams to execute optical-electrical testing, and developing end-to-end manufacturing and test solutions.
Responsibilities:
- Collaborate with cross-functional engineering teams to provide feedback on DFM and PFMEA
- Partner with quality teams to execute optical-electrical testing, de-risking, and industry-standard qualification processes
- Develop end-to-end manufacturing and test solutions, qualify and release to production
- Improve alpha/beta/pilot stage product build yield, troubleshoot, and ensure manufacturing readiness
- Involve in NPI with focus on manufacturing process development for optical transceivers or optical sub-assemblies
- Transition advanced optical designs into high-volume production, drive manufacturing readiness, characterization, and PFMEA
- Establish manufacturing metrics to drive continuous improvement of equipment performance and process
- Drive characterization of NPI and sustaining product yields
Minimum Qualifications:
- MS or PhD in Electrical Engineering and/or related engineering fields
- 8+ years of industry experience in product engineering or product development for high-volume production with focus on silicon photonics, optical transceivers, or opto-electronic packaging sub-assemblies
- Proven track record of transitioning products from NPI to High volume production
- Knowledge and experience with design for manufacturability (DFM) during product development
- Proficiency in statistical and analytical tools such as Python, JMP Scripting, AI models
- Experience in opto-electrical testing, Failure Analysis, and PFMEA Yield predicting, monitoring, and improvement
Preferred Qualifications:
- Experience with active optical alignment, die attach, wire bonding, wafer packaging
- Experience with chip packaging assembly processes development
- Experience with product development tasks: Bill of Materials and Change Management
- Excellent communication, stakeholder management, and problem-solving skills
- Experience with Optics and Silicon Photonics sub-assemblies
Benefits:
- Medical, dental, and vision insurance
- 401(k) plan with Cisco matching contribution
- Paid parental leave
- Short and long-term disability coverage
- Basic life insurance
- Paid time away
- Optional 10 paid days per full calendar year to volunteer