Space Electronics Packaging and Mechanical Product Design and Analysis Engineer (Associate or Mid-level)

The Boeing Company, specifically the Boeing Defense, Space and Security (BDS), Space, Intelligence & Weapons Systems (SI&WS) division, is looking for a Space Electronics Packaging and Mechanical Product Design and Analysis Engineer to join their team in El Segundo, California.

As a Space Electronics Packaging Design and Analysis Engineer, you will play a pivotal role in shaping the future of space exploration. You will be part of a team that conducts full in-house cradle-to-grave work, contributing to every stage of the product lifecycle, from initial design concepts to prototyping and final production. This includes mechanical PCB design, Electronics Packaging, and Thermal/Structural/Vibration Analysis.

Responsibilities:

• Coordinate with multi-discipline groups to develop and understand requirements and create high-level and detailed designs
• Perform trade studies to optimize structure and meet program requirements
• Conduct detailed structural and thermal analysis using hand calculations and analysis tools
• Document structural analyses and data to show compliance with Boeing, customer and regulatory requirements
• Collaborate with Electrical Engineering team to perform sizing and placement studies, layout and route printed circuit boards (PCBs)
• Validate designs through review, testing and analysis
• Develop, deploy and support new processes and process improvements
• Conduct Root Cause and Corrective Action to investigate failures
• Identify, track and status technical performance measures
• Support Supplier Management with make/buy recommendations and technical services
• Investigate emerging technologies for future product designs

The position requires a Bachelor of Science degree in Engineering (Electrical, Mechanical or Aeronautical), Computer Science, Data Science, Mathematics, Physics, Chemistry or equivalent qualifications. 2+ years of experience using Computer-Aided Design (CAD) tools and experience in electronic packaging, printed circuit board design and assembly (PCB/PCBA), or thermal, structural, dynamics, and/or vibration analysis and tools are also required.

Benefits include competitive base pay, variable compensation opportunities, health insurance, flexible spending accounts, health savings accounts, retirement savings plans, life and disability insurance programs, and paid time away from work.

Salary ranges from $98,600 to $133,400 for Associate-level and $119,850 to $162,150 for Mid-Level.