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From the employer's careers site First seen 1 Nov 2026 · Still live on 13 Nov 2026

Principal Signal Integrity Engineer – R&D Networking Platforms

Salary

$158,000 - $321,000 per year

Apply on Hewlett Packard Enterprise

Description

We are seeking a highly accomplished Principal Signal Integrity Engineer to provide technical leadership for signal and power integrity across multiple networking platforms and future technology generations.

As a Principal Signal Integrity Engineer, you will serve as the organization's technical authority for signal and power integrity, driving architectural decisions, engineering excellence, and innovation across multiple product families.

Responsibilities:

  • Define and drive the SI/PI technical strategy, methodologies, design standards, and engineering best practices across networking hardware platforms.
  • Lead signal and power integrity architecture for next-generation networking systems, influencing platform design from concept through production.
  • Provide technical leadership for high-speed interfaces, including next-generation SerDes technologies operating at leading-edge data rates.
  • Establish company-wide SI/PI design guidelines, PCB stackup strategies, routing methodologies, and validation approaches to ensure scalable and repeatable success.
  • Lead cross-functional technical reviews and drive resolution of the most complex SI/PI challenges spanning multiple products and engineering disciplines.
  • Develop advanced simulation methodologies, modelling approaches, and automation techniques to improve engineering productivity and design quality.
  • Drive SI/PI technology readiness for future generations of networking products, evaluating emerging technologies and enabling adoption of new architectures and materials.
  • Lead root-cause investigations of complex field, validation, and manufacturing issues involving signal integrity, power integrity, timing, and electromagnetic interactions.
  • Partner with ASIC, package, PCB, mechanical, thermal, and system architects to optimize end-to-end electrical performance.
  • Champion technical innovation through patents, industry engagement, publications, and contributions to next-generation technology development.
  • Mentor and develop engineers across multiple sites, helping build organizational SI expertise and long-term technical capability.
  • Serve as the final escalation point for critical SI/PI technical decisions, balancing performance, risk, schedule, and product cost.

Requirements:

  • Bachelor's, Master's, or PhD degree in Electrical Engineering, Computer Engineering, or related field.
  • 15+ years of experience in signal integrity, power integrity, package design, PCB design, and high-speed system architecture.
  • Recognized expert in high-speed digital system design with deep understanding of electromagnetic theory, transmission line behavior, crosstalk, loss mechanisms, jitter, equalization, and channel optimization.
  • Extensive experience architecting and validating high-speed systems utilizing advanced SerDes technologies and complex networking platforms.
  • Demonstrated success leading SI/PI strategies across multiple large-scale product developments from concept through production.
  • Expert knowledge of SI/PI simulation methodologies, including time-domain, frequency-domain, statistical, BER, and electromagnetic analysis.
  • Deep expertise with industry-standard tools such as Synopsys HSPICE, Keysight ADS, Ansys HFSS, SIwave, PowerSI, and Cadence design environments.
  • Extensive experience defining PCB stackups, design constraints, routing architectures, power distribution networks, and signal integrity requirements for high-volume products.
  • Hands-on expertise using advanced laboratory instrumentation including VNAs, TDRs, high-bandwidth oscilloscopes, spectrum analyzers, and compliance test equipment.
  • Proven ability to correlate simulation results with laboratory measurements and drive improvements in modelling accuracy and design predictability.
  • Strong understanding of system-level interactions between signal integrity, power integrity, thermal performance, electromagnetic compatibility, and manufacturability.

Preferred Qualifications:

  • Demonstrated technical leadership across geographically distributed engineering teams.
  • Ability to influence architecture and engineering decisions across organizations without direct authority.
  • Proven track record of mentoring engineers and developing technical capabilities within an organization.
  • History of innovation through patents, publications, industry collaboration, or significant technical contributions.
  • Excellent communication and presentation skills, with the ability to explain complex technical concepts to engineers, architects, executives, and customers.
  • Strong business and engineering judgment, balancing technical excellence with schedule, product cost, risk, and scalability considerations.
  • Self-directed leader capable of defining technical direction in highly ambiguous environments.

Benefits:

  • Comprehensive suite of benefits that supports physical, financial, and emotional wellbeing.
  • Investment in career development and growth.
  • Unconditional inclusion and celebration of individual uniqueness.

Salary: $158,000 - $321,000 per year

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Skills

Required

  • Electrical Engineering
  • Computer Engineering
  • Signal Integrity
  • Power Integrity
  • PCB Design
  • High-Speed System Architecture
  • SerDes technologies
  • SI/PI simulation methodologies
  • Electromagnetic analysis
  • Synopsys HSPICE
  • Keysight ADS
  • Ansys HFSS
  • SIwave
  • PowerSI
  • Cadence design environments

Nice to have

Apply on Hewlett Packard Enterprise