Distinguished Signal & Power Integrity Engineer

We are seeking a Distinguished Signal & Power Integrity Engineer to join our dynamic team working with state-of-the-art technology.

As a Distinguished Signal & Power Integrity Engineer at NVIDIA, you will lead the development and execution of corporate-level strategies for high-speed signaling technologies across advanced semiconductor packaging, sockets, and connectors.

Key Responsibilities:

• Lead the development and execution of corporate-level strategies for high-speed signaling technologies across advanced semiconductor packaging, sockets, and connectors.
• Oversee technical direction and implementation for next-gen products ranging from ultra-mobile to high-performance AI and HPC platforms.
• Architect and deliver state-of-the-art interconnect and packaging solutions for standards such as UCIe, HBM, DDR, PCIe, and industry-leading SerDes (224G/448G).
• Enable advanced packaging technology solutions for co-packaged optics, stacked die, chiplet-based architectures, and IVR solutions.
• Develop modeling and characterization flows, flow automations, and design for high-volume manufacturing techniques.
• Offer strategic counsel as a recognized subject matter expert to senior leadership on emerging technologies, technology investment, and research priorities in signaling, packaging, and system integration.

Requirements:

• 15+ years leading innovations spanning high-speed signal integrity, computational electromagnetics, and semiconductor assembly technologies.
• MS/PhD in Electrical Engineering or equivalent with 15+ years of industry experience.
• Hands-on invention and deployment of advanced solutions, e.g., EMIB, UCIe, CPO, high-density connectors.
• Deep experience with electrical, computer, and packaging engineering and deployment of such in products.
• Demonstrated ability to manage and mentor teams of highly skilled engineers, define methodologies, and deliver complex projects from research to high-volume manufacturing.

Nice to Have:

• An industry veteran with a proven track record of bringing advanced SI concepts from research to product.
• A known pioneer in any industry-standard high-speed signaling technology.
• Deep knowledge of operation and manufacturing challenges of package substrate, PCB, cables, and connectors.

Your base salary will be determined based on your location, experience, and other objective job-related factors. The expected base salary range for this position is 320,000 USD – 488,750 USD. You will also be eligible for equity and benefits.