Director, Technical Sales, 3DIC Solutions

You will engineer the future with Synopsys, the leader in engineering solutions from silicon to systems. As Director, Technical Sales, 3DIC Solutions, you will lead technical sales campaigns for 3DIC solutions across strategic semiconductor accounts, managing complex, multi-quarter engagements from discovery through close.

You have spent years in the EDA world, likely starting as an Applications Engineer or Product Specialist, and you have learned that the best technical wins come from understanding the customer's business problem before you ever open the demo. You know how to sit across from a VP of Engineering at a major semiconductor company and map their 3DIC roadmap to a multi-quarter technical campaign that actually closes.

Your responsibilities will include:

• Lead technical sales campaigns for 3DIC solutions across strategic semiconductor accounts
• Drive customer discovery sessions to uncover technical requirements, business drivers, and solution fit
• Serve as the primary business and sales focal point for 3DIC opportunities
• Build and maintain executive and technical relationships across customer organizations
• Work directly with Applications Engineering teams to align proof-of-concept activities, evaluations, and deployments with customer success criteria and timelines

The impact you will have:

• Expand 3DIC solution adoption across strategic accounts, directly driving revenue growth
• Shape customer roadmaps by identifying opportunities early and aligning Synopsys capabilities with their long-term technical and business objectives
• Accelerate deal cycles by managing complex technical campaigns with clarity
• Influence product direction by feeding market requirements, competitive insights, and customer feedback directly to Product Management and R&D teams

You will need:

• 5+ years of experience in EDA sales, Applications Engineering, or Product Specialist roles with a strong technical foundation in semiconductor design or advanced packaging technologies
• Direct experience in the 3D IC market segment, including familiarity with chiplet architectures, advantage packaging (interposer) and substrate design, and System Technology Co-Optimization (STCO)
• Proven ability to manage long-term enterprise sales engagements
• Strong relationship-building skills with a track record of developing executive and technical relationships across customer organizations
• Ability to collaborate internally with Product Management and R&D teams to align customer requirements with product capabilities and roadmaps

Rewards and benefits include a comprehensive range of health, wellness, and financial benefits.