Director, Product Sales Solutions (3DIC)

You will engineer the future with Synopsys, the leader in engineering solutions from silicon to systems, enabling customers to rapidly innovate AI-powered products. You will be part of a team that delivers industry-leading silicon design, IP, simulation and analysis solutions, and design services.

As a Director, Product Sales Solutions (3DIC), you will lead technical sales campaigns for 3DIC solutions across strategic semiconductor accounts in Taiwan, managing complex, multi-quarter engagements from discovery through close. You will drive customer discovery and qualification to uncover business opportunities, map technical requirements, and align solution fit with customer roadmaps.

Key responsibilities include:

• Leading technical sales campaigns for 3DIC solutions
• Driving customer discovery and qualification
• Developing and executing account engagement strategies
• Serving as the primary business and sales focal point for 3DIC opportunities
• Building and maintaining executive and technical relationships across customer organizations
• Identifying, prioritizing, and expanding opportunities within strategic accounts
• Tracking campaign progress, customer success criteria, and business outcomes using CRM systems

The impact you will have includes:

• Accelerating adoption of 3DIC solutions at strategic semiconductor accounts
• Shaping how leading semiconductor companies approach advanced packaging and chiplet integration
• Influencing product roadmaps by channeling market requirements, competitive intelligence, and customer feedback
• Enabling Applications Engineering teams to deliver more effective technical engagements
• Building long-term customer relationships that extend beyond individual deals
• Expanding Synopsys footprint within accounts by identifying new use cases, stakeholders, and design programs

To be successful in this role, you will need:

• 15+ years of experience in EDA sales, Applications Engineering, or Product Specialist roles with a strong technical foundation in semiconductor design or advanced packaging technologies
• Direct experience in the 3DIC market segment
• Proven ability to manage enterprise sales engagements and lead long-term technical campaigns
• Strong relationship-building skills
• Ability to collaborate effectively with internal teams
• Willingness and ability to travel up to 30% to customer sites, industry events, and internal meetings

Rewards and benefits include a comprehensive range of health, wellness, and financial benefits.