Description
We are seeking a Thermal Engineer (Direct Liquid Cooling) to join our team in Houston, TX. This role has been designed as 'Hybrid' with a requirement that you will work on average 2 days per week from an HPE office.
As a Thermal Engineer, you will lead mechanical and thermal design of liquid-cooled server platforms and rack-level cooling architectures. You will develop cooling solutions including CPU and GPU cold plates, coolant manifolds, tubing and hose routing systems, blind-mate fluid connections, quick disconnects, rack coolant distribution interfaces, and serviceability features.
Key responsibilities:
- Design and integrate mechanical solutions that support high-density compute, accelerator, memory, storage, and power delivery subsystems.
- Define server and rack thermal architectures to meet performance, reliability, acoustics, power, and customer deployment requirements.
- Conduct thermal analysis using CFD, analytical calculations, and laboratory testing to optimize airflow, coolant flow, heat transfer performance, and rack thermal efficiency.
- Develop and execute qualification plans for thermal performance, leak integrity, structural reliability, shock and vibration, material compatibility, corrosion resistance, and manufacturing robustness.
- Drive root-cause analysis and corrective actions for thermal, mechanical, and liquid cooling issues discovered during development, qualification, manufacturing, and field deployment.
- Lead technical engagements with suppliers, ODMs, and manufacturing partners to ensure successful implementation of liquid cooling hardware.
- Represent the mechanical and thermal engineering team during architecture reviews, design reviews, requirements reviews, and executive program reviews.
- Mentor junior engineers and provide technical guidance on mechanical design, thermal engineering, liquid cooling technologies, and product development processes.
Requirements:
- Bachelor's or Master's degree in Mechanical Engineering.
- Typically, 4-6 years of mechanical and thermal engineering experience.
- Experience developing server, networking, storage, AI, HPC, or data center hardware preferred.
- Experience with liquid cooling technologies and electronics thermal management strongly preferred.
Strong foundation in:
- Heat transfer
- Fluid mechanics
- Thermodynamics
- Electronics cooling
- Mechanical system design
Expertise in server mechanical architecture and electronics packaging. Proficiency with Creo (Pro/ENGINEER) or equivalent 3D CAD tools. Experience using CFD and thermal modeling tools to develop and validate cooling solutions.
Understanding of:
- Cold plate design
- Coolant flow distribution
- Pressure drop optimization
- Thermal interface materials
- Coolant chemistry
- Material compatibility
- Condensation and reliability considerations
Knowledge of sheet metal design, castings, machined components, plastics, and manufacturing processes. Strong analytical and troubleshooting skills. Excellent communication skills with the ability to present technical tradeoffs and influence design decisions across engineering, operations, and supplier organizations.
We offer a comprehensive suite of benefits that supports the physical, financial, and emotional wellbeing of our team members and their loved ones.