Sr Staff Advanced Package Design Engineer

You are a seasoned hardware engineering professional with a passion for advanced silicon package design and a proven track record in delivering innovative solutions for complex semiconductor challenges.

At Synopsys, we drive the innovations that shape the way we live and connect. Our technology is central to the Era of Pervasive Intelligence, from self-driving cars to learning machines.

What You'll Be Doing:

• Collaborate with cross-functional teams during early design stages to optimize and define SIPI performance requirements.
• Design and develop advanced silicon package solutions such as silicon interposers, RDL fanout packages, and silicon bridge packages.
• Model and analyze advanced package designs to ensure optimal electrical, thermal, and mechanical performance.
• Represent Synopsys on business unit projects as a technical leader and subject matter expert in advanced packaging.
• Resolve a wide range of design and integration issues using creative, data-driven approaches.
• Support customer engagements in exploring and implementing advanced package solutions with Synopsys IPs.
• Collaborate with global teams to share best practices and drive innovation in advanced packaging methodologies.

The Impact You Will Have:

• Empower Synopsys and its customers to deliver next-generation, high-performance silicon solutions.
• Accelerate the adoption of advanced packaging technologies that enable new levels of integration and energy efficiency.
• Enhance the performance, reliability, and manufacturability of Synopsys IP test chip packages.
• Drive technical excellence and innovation in business unit projects that define Synopsys' leadership in the semiconductor industry.
• Mentor and guide engineering peers, fostering a culture of knowledge sharing and continuous improvement.
• Set new industry standards for quality, performance, and innovation in advanced package design.
• Build and strengthen customer relationships through expert support and collaboration.

What You'll Need:

• Bachelor's degree in Electrical or Electronic Engineering (Master's or PhD preferred).
• Minimum of 10 years' relevant experience in advanced package design, model extraction, and analysis.
• Expert knowledge of advanced circuit and transmission line theory.
• Hands-on experience with TSMC, Intel, Samsung, or OSAT advanced package technologies.
• Proficiency in multi-physics analysis (EMIR, Thermal, Thermal-Mechanical, Electromagnetic, etc.).
• Familiarity with both Windows and Linux operating systems.
• Experience with industry-standard EDA tools such as Cadence APD, Innovus, Integrity-3DIC, Synopsys ICC2, 3DIC Compiler, and Fusion Compiler.

Rewards and Benefits:

• Comprehensive medical and healthcare plans.
• Time away programs, including ETO and FTO.
• Family support, including maternity and paternity leave, parenting resources, adoption and surrogacy assistance.
• ESPP: purchase Synopsys common stock at a 15% discount.
• Retirement plans that vary by region and country.
• Competitive salaries.