IC Packaging Engineer

NVIDIA, a world-class technology company, is seeking a passionate Package Engineer to join our team in Israel. As a Package Engineer, you will work closely with SI, layout, and ASIC design teams to develop complex, top-of-the-line ASIC packages.

What you will be doing:

• Leading development of cutting-edge microelectronics packaging of NVIDIA Networking Business Unit’s future products, evaluating NVIDIA products for reliability and performance.
• Review manufacturability readiness at each milestone.
• Work with world leading vendors to develop highly challenging packaging solutions.
• Leading the development of groundbreaking microelectronics packaging for NVIDIA Networking Business Unit's future products
• Collaborating with world-leading vendors to develop highly ambitious packaging solutions
• Thriving in a dynamic and challenging environment
• Join and lead task forces to investigate and support production excursions, failure analysis and reliability issues and establish quality standards.
• Monitor substrate and assembly production KPIs and collaborate with cross functional teams to define and monitor Yield Improvement Plans for continuous improvement and establish quality standards.
• Lead process changes reviews, prepare and present data in Change Control Board meetings, lead technical reviews of product changes throughout the supply chain.

What we need to see:

• BSc or equivalent Mechanical/Material Engineering degree, or any related equivalent experience.
• 2+ years of relevant work experience in the semiconductor packaging or equivalent experience, development and manufacturing.
• Basic design skills, such as using 2D ArtiosCAD, and 3D NX/SolidWorks/Creo applications.
• Experience in DFM, understand tooling design, manufacturing processes, material properties and metrology tools.
• High awareness for quality, robustness, and manufacturability.
• High self-learning and self-motivation skills, fostering a culture of continuous learning, ongoing process improvement and proactive approach.
• Leadership skills, capability to lead cross company projects that involve cross functional teams in different locations.
• Curious and creative problem solver, well organized and multi-tasker.

Ways to stand out of the crowd:

• Hands-on FEA mechanical simulation experience - Advantage
• Team / Group / Project management - Advantage
• Experience with manufacturing environment and manufacturing statistics tools
• Background in engineering semiconductor manufacturing processes