Skip to content
Updated How AI-exposed are the skills employers are hiring for? See the data →

From the employer's careers site First seen 1 Nov 2026

Mechanical Engineer, Thermal & Packaging

The employer hasn't listed a salary.

Apply on Hewlett Packard Enterprise

Description

We are seeking a Mechanical Engineer, Thermal & Packaging to join our team in Bengaluru, Karnātaka, India. As a Mechanical Engineer, Thermal & Packaging, you will design, analyze, develop, modify, and evaluate mechanical and thermal hardware, electronic enclosures, and production tooling.

Responsibilities:

  • Design, analyze, develop, modify, and evaluate mechanical and thermal hardware, electronic enclosures, and production tooling.
  • Develop and implement test plans for new and existing designs, including tolerance analysis, form-fit-function, shock and vibration, EMI, safety, reliability, acoustics, fan curves, and system power measurements.
  • Conduct feasibility studies, design margin analysis, validation, and empirical testing.
  • Use CFD analysis and thermal mockups to validate thermal solutions.
  • Collaborate with management, internal teams, and external development partners on design status, project progress, and issue resolution.
  • Lead mechanical engineering project teams to deliver reliable, cost-effective, and high-quality solutions.
  • Represent the mechanical and thermal engineering team throughout complex product development projects.
  • Provide technical guidance and mentoring to junior engineers.

Requirements:

  • Bachelor's or Master's degree in Mechanical Engineering.
  • Typically 4–6 years of relevant mechanical engineering experience.
  • Proficiency in ProEngineer (ProE/Creo) or other 3D CAD software.
  • Strong understanding of electronics packaging and mechanical hardware design.
  • Experience designing sheet metal and plastic components, including production tooling and manufacturing processes.
  • Knowledge of CFD, thermal simulation, and thermal mockups for thermal validation.
  • Strong analytical, problem-solving, and design validation skills.
  • Excellent written and verbal communication skills in English and Kannada.
  • Ability to communicate product architectures and design proposals, negotiate technical options with management, and coordinate cross-functional teams.

Benefits:

  • Comprehensive suite of benefits that supports physical, financial, and emotional wellbeing.
  • Investment in your career through specific programs catered to helping you reach your career goals.
  • Unconditionally inclusive work environment that celebrates individual uniqueness.

Skills

Required

Ready to apply?

You apply with the employer directly. Their original posting is here: https://hpe.wd5.myworkdayjobs.com/en-US/Jobsathpe/job/Bengaluru-Karntaka-India/Mechanical-Engineer--Thermal---Packaging_1213942-2

Apply on Hewlett Packard Enterprise