Senior Director, Board Product Development Engineering

NVIDIA's advanced datacenter boards push forward chip packaging, PCB fabrication, SMT, assembly, and testing capabilities. The Senior Director, Board PDE oversees integration methods that make this possible,coordinating handoffs, engineering cross-domain effects before changes, and optimizing the entire chain.

Responsibilities:

• Design, implement, and institutionalize the integration readiness process for all next-generation datacenter board products , owning manufacturing and test readiness end to end so build starts land on schedule and at target yield.
• Guide the functional teams in developing cross-boundary techniques before silicon and stackup freeze occurs. Focus on warpage-tolerant DFM and reflow for next-gen BGA pitch. Manage impedance and CTE control for high-speed stackups. Lock pad-map and fab methods at an early stage.
• Build, lead, and develop a global Board PDE organization across three technical pillars , PCB & Fab, SMT/PCBA, and High-Speed Connector & Signal Integrity.
• Set up integration oversight throughout the chip-to-board stack. Define entry and exit requirements at each domain boundary. Lead the gates to confirm one qualified domain is ready to pass to the next.
• Collaborate with Operations Test Engineering and Signal Integrity to establish test coverage and manufacturing test flow requirements, applying that thoroughness to the tester and diagnostic boards.
• Take charge of reliability and yield performance throughout the stack. Investigate excursions to identify root causes. Address DFx and alternate-component gaps with the factory planning and design teams.
• Support manufacturing partners (CM/ODM/OSAT, substrate, and PCB fab) in producing world-class datacenter products. Serve as the senior chip-to-board representative across NVIDIA's Operations, Engineering, and Executive teams.

Requirements:

• BS in Electrical Engineering, Materials Science, or a related technical field (or equivalent experience); MS or PhD is a plus.
• 15+ overall years in product, manufacturing, or operations engineering for high-complexity electronics. You have 8+ years leading engineering teams and 5+ years leading leaders in a global, cross-matrixed organization.
• A track record of taking complex board and system products from design through NPI to high-volume manufacturing, with clear ownership of schedule, yield, and quality outcomes.
• Comprehensive technical knowledge covering the chip-to-board stack: advanced packaging and flip-chip BGA, high-density and high-layer-count PCB fabrication, SMT and assembly process qualification, and board-level reliability.
• Solid expertise in high-speed signal integrity and manufacturing testing , BERT, channel margining, defining structural and functional test coverage, along with diagnostic and tester board development.
• Demonstrated success building cross-functional processes and sign-off gates that hold up under schedule pressure, with the technical credibility to influence domain owners without owning their qualification.
• Experience collaborating with ODM/CM/OSAT and PCB fab suppliers to qualify new methods before production, rather than just completing existing ones.
• Excellent executive communication , able to distill ambiguous, fast-moving technical information into concise, decision-ready recommendations for technical and non-technical audiences alike.
• Enthusiasm for fast-paced, ambiguous environments where technology changes constantly, and willingness to travel internationally (~20%), primarily to manufacturing partners in Asia.

Benefits:

• Competitive salaries
• Generous benefits package
• Equity eligibility
• Visit www.nvidiabenefits.com/ for more information