Description
We are seeking an exceptional engineering leader to join our team and become part of something truly remarkable. As a Mechanical Product Design, RF Space Electronics Engineering Manager, you will play a pivotal role in shaping the future of space exploration with us.
You will manage a team that conducts full in-house cradle-to-grave work, providing you with a unique and fulfilling experience. You will support a motivated and diverse team through every stage of the product lifecycle, from initial design concepts to prototyping and final production. This includes mechanical Printed Circuit Board design, Electronics Packaging, and Thermal/Structural/Vibration Analysis.
Your team will be at the forefront of satellite missions, unlocking new frontiers in space exploration. The breadth of our work while working alongside world-class engineers and mentors will inspire and guide you and challenge you to expand your skillset and delve into fascinating new areas, making every day a thrilling adventure.
Position Responsibilities:
- Manages employees performing RF product design engineering and technical activities
- Develops and executes integrated departmental plans, policies and procedures and provides input on departmental business and technical strategies, goals, objectives
- Acquires resources for department activities, provides technical management of suppliers and leads process improvements, corrective actions
- Develops and maintains relationships and partnerships with customers, stakeholders, peers, partners and direct reports
- Develops direct reports
Basic Qualifications (Required Skills/ Experience):
- This position requires an active U.S. Top Secret/SCI Security Clearance (U.S. Citizenship Required)
- Bachelor of Science degree in Engineering (with a focus in Electrical, Mechanical or Aeronautical), Computer Science, Data Science, Mathematics, Physics, Chemistry or non-US equivalent qualifications directly related to the work statement
- Candidates must have at least one year of experience in a leadership role or have completed the Boeing internal course “Exploring Leadership.”
- 5+ years of experience in Electronics Packaging Design in any of the following disciplines: Airborne, Space, Digital, RF or Power mechanical systems
- 5+ years of experience with Electrical, Electronic, and Electromechanical (EEE) component, Circuit Card Assembly, and Printed Wiring Board specification and quality requirements
Preferred Qualifications (Desired Skills/Experience):
- Previous experience in designing digital or power units
- Master’s Degree in Mechanical or Aerospace Engineering
- Experience in structural and thermal analysis
- Background in Earned Value Management System (EVMS)
- Proficiency in CREO, Teamcenter, MS Project and Expedition
- 5+ years of experience leading engineering teams
Benefits:
- Competitive base pay and variable compensation opportunities
- Health insurance, flexible spending accounts, health savings accounts, retirement savings plans, life and disability insurance programs, and a number of programs that provide for both paid and unpaid time away from work