Sr Staff Advanced Package Design Engineer

You are a seasoned hardware engineering professional with a passion for advanced silicon package design and a proven track record in delivering innovative solutions for complex semiconductor challenges.

You will be collaborating with cross-functional teams during early design stages to optimize and define SIPI performance requirements, including bump mapping and power estimation.

Key responsibilities include:

• Designing and developing advanced silicon package solutions such as silicon interposers, RDL fanout packages, and silicon bridge packages.
• Modeling and analyzing advanced package designs to ensure optimal electrical, thermal, and mechanical performance.
• Representing Synopsys on business unit projects as a technical leader and subject matter expert in advanced packaging.
• Resolving a wide range of design and integration issues using creative, data-driven approaches.
• Supporting customer engagements in exploring and implementing advanced package solutions with Synopsys IPs.
• Collaborating with global teams to share best practices and drive innovation in advanced packaging methodologies.

The ideal candidate will have:

• Bachelor’s degree in Electrical or Electronic Engineering (Master’s or PhD preferred).
• Minimum of 10 years’ relevant experience in advanced package design, model extraction, and analysis.
• Expert knowledge of advanced circuit and transmission line theory.
• Hands-on experience with TSMC, Intel, Samsung, or OSAT advanced package technologies.
• Proficiency in multi-physics analysis (EMIR, Thermal, Thermal-Mechanical, Electromagnetic, etc.).
• Familiarity with both Windows and Linux operating systems.
• Experience with industry-standard EDA tools such as Cadence APD, Innovus, Integrity-3DIC, Synopsys ICC2, 3DIC Compiler, and Fusion Compiler.

Benefits include:

• Comprehensive medical and healthcare plans
• Time away programs
• Family support
• ESPP
• Retirement plans
• Competitive salaries