Senior Packaging Technical Engineer - Hardware

We are seeking a Senior Packaging Technical Engineer to join our team.

Your responsibilities will include defining the chip pad ring, substrate interconnect scheme, and leading the package layout design process.

You will collaborate with large teams consisting of Circuit, Signal Integrity, RTL, Place and Route, substrate layout, and system design Engineers and Managers.

Your goal will be to define a chip floor plan, pad ring, substrate, and ball out implementing a robust world-class electrical package, and communicate effectively with various teams throughout the company.

Requirements:

• BSEE or equivalent experience.
• Minimum of 5+ years in board/system design. Experience with package design is preferred.
• Good understanding of transmission line theory, power delivery, and signal integrity is desired.
• Strong programming and scripting skills in Perl, Python, Tcl desired, Cadence Skill and EXCEL familiarity are helpful.
• Enthusiastic and able to work with a minimum of supervision.
• You seek to solve complex technical problems.

NVIDIA offers competitive salaries and a generous benefits package.