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Synopsys

Applications Engineering, Sr Director (3DIC)

Synopsys
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senior full-time Hsinchu

First indexed 21 Oct 2026

Description

You will lead the non-Americas AE team for our 3DIC and advanced packaging portfolio at Synopsys, a company that delivers industry-leading silicon design, IP, simulation and analysis solutions, and design services.

Your role involves leading and scaling the non-Americas application engineering team supporting Synopsys' 3DIC and advanced packaging solution portfolio across a growing customer base.

Key responsibilities include:

  • Setting the technical strategy for how your AE organization engages customers on complex 3DIC design challenges
  • Driving customer discovery, opportunity qualification, and technical sales campaigns that result in design wins and measurable revenue growth
  • Building and managing a team of senior application engineers who can operate independently with customers and deliver results
  • Partnering with sales, product, and R&D teams to align customer needs with product roadmaps
  • Owning customer escalations and technical roadblocks that require senior leadership engagement

The impact you will have includes:

  • Scaling Synopsys' presence in high-growth semiconductor markets
  • Driving adoption of 3DIC, advanced packaging, and multi-physics solutions in accounts
  • Increasing design win rates and customer satisfaction
  • Developing the next generation of technical leaders within Synopsys
  • Influencing product strategy by bringing customer insights and market trends back to R&D and product teams

Requirements:

  • 10+ years in application engineering, technical sales, or customer-facing roles within the EDA or semiconductor industry
  • Expertise in digital implementation, 3DIC design construction, and multi-physical analysis
  • Proven track record managing geographically distributed teams
  • Experience driving new business acquisition, competitive displacement, and technical sales campaigns
  • Strong understanding of 3DIC technologies, advanced packaging, and the broader semiconductor design ecosystem

Rewards and benefits include a comprehensive range of health, wellness, and financial benefits.

This listing is enriched and indexed by YubHub. To apply, use the employer's original posting: https://careers.synopsys.com/job/hsinchu/applications-engineering-sr-director-3dic/44408/101631905344