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From the employer's careers site First seen 29 Oct 2026

Mechanical (Finite Element) Simulation Engineer

Hewlett Packard Enterprise Hybrid mid full-time

The employer hasn't listed a salary.

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Description

We are seeking a Mechanical (Finite Element) Simulation Engineer to develop and apply advanced modeling and simulation techniques to support the design, development, validation, reliability, and optimization of mechanical, thermal, electronic, and system-level products.

Responsibilities:

  • Perform mechanical, thermal, and reliability simulations using Finite Element Analysis (FEA) tools such as ANSYS to evaluate and optimize component, assembly, and system designs.
  • Develop and maintain realistic simulation models for semiconductor devices, electronic components, PCB assemblies, enclosures, and complete systems.
  • Conduct early-stage design assessments to identify reliability, quality, manufacturability, and performance risks.
  • Analyze design variations and manufacturing process impacts on component and system reliability.
  • Collaborate with mechanical, electrical, reliability, manufacturing, and quality engineering teams to resolve complex technical challenges.
  • Develop and recommend accelerated test methodologies and interpret test results to identify failure mechanisms and corrective actions.
  • Support root cause investigations related to product quality, field failures, and reliability concerns.
  • Evaluate material properties, constitutive models, and failure mechanisms to improve product robustness.

Requirements:

  • Bachelor's degree in Mechanical Engineering, Materials Science, or a related engineering discipline.
  • Minimum of 2-4 years of experience in engineering simulation, mechanical analysis, or product development.
  • Hands-on experience with ANSYS or equivalent Finite Element Analysis software.
  • Strong understanding of mechanical design principles, materials behavior, and engineering fundamentals.
  • Knowledge of electronic assemblies, semiconductor technologies, and manufacturing processes.
  • General understanding of common semiconductor technology and electronic system manufacturing processes is highly desired.
  • Familiarity with failure modes and mechanisms of components and electronic assemblies.
  • Strong analytical, problem-solving, and troubleshooting skills.
  • Excellent written and verbal communication skills with the ability to present technical findings effectively.
  • Ability to work independently and collaboratively in a cross-functional environment.
  • Advanced English Level.

Benefits:

  • Comprehensive suite of benefits that supports physical, financial, and emotional wellbeing.
  • Investment in career development and growth.
  • Unconditionally inclusive work environment.

Work Arrangement: Hybrid, with an average of 2 days per week in an HPE office.

Skills

Required

  • Mechanical Engineering
  • Materials Science
  • Finite Element Analysis
  • ANSYS
  • Simulation Modeling
  • Reliability Analysis

Nice to have

  • Semiconductor Technology
  • Electronic System Manufacturing
  • Failure Modes and Mechanisms
Apply on Hewlett Packard Enterprise