Description
We are seeking a Senior Reliability Engineer to join our team as an individual contributor. The successful candidate will develop product level reliability qualification plans and implement qualifications for new NVIDIA products, including IC chips in AI, Data Center, Mobile, Automotive, Deep Learning, Graphic Processor, and System on Chip sectors.
Responsibilities:
- Develop and implement product level reliability qualification plans
- Collaborate with design, customer engineering, product/test engineering, and packaging engineering teams to develop reliability qualification plans
- Work with DFT and product engineering teams for qualification test programs, validation, and data analysis
- Investigate and analyze data, failures, and failure mechanisms to drive corrective and preventive actions
- Participate in assessments of reliability test requirements for non-conforming materials and maintain/improve reliability databases
- Communicate clearly and produce product reliability qualification reports and presentations
Requirements:
- Strong technical background in wafer fab with advanced process node, Flip Chip BGA, and COWOS packaging and assembly process technologies
- Knowledge of CMOS/Fin FET devices physics and familiarity with reliability statistics, models, and failure mechanisms
- Familiarity with industry standards (JEDEC, IPC, AEC-Q100) for Silicon Die and package level qualification
- Proficiency in reliability data analysis tools such as JMP, Weibull++, and/or Minitab
- 8+ years of experience in IC reliability
- BS or higher degree in Electrical Engineering, Computer Engineering, or equivalent experience; MS or PhD in EE is preferable