Description
The Common Hardware Group at Cisco is seeking a Thermal Design Engineer to join our team. You will design and develop thermal solutions for systems with high-power ASICs and high-density optical transceivers. Your responsibilities will include:
- Developing detailed package, board, and system level simulations using Computational Fluid Dynamic tools such as Flotherm or Icepak
- Collaborating with Distinguished Engineers and Hardware leads on system architectures and cooling
- Performing thermal testing to validate simulation models
- Leading and mentoring other thermal engineers in the group
- Collaborating with mechanical engineers and other cross-functional teams to identify risks and deliver objective, data-driven solutions
The ideal candidate will have:
- Bachelor's degree in Mechanical or Thermal Engineering + 12 years of related experience, or Master's degree + 8 years of related experience, or PhD + 5 years of related experience
- 5+ years of experience in design, simulation, and testing of thermal solutions for electronic devices and systems
Preferred qualifications include:
- Experience in use of Computational Fluid Dynamic analysis tools such as Flotherm or Icepak
- Knowledge and experience with advanced air-cooling technologies
- Experience with designing liquid cooling and/or immersion cooling systems
- Experience with performing other analysis such as Finite Element Analysis (FEA) and Data Center cooling simulations
- Experience with 3D MCAD modeling tools such as PTC's Creo or NX
In terms of compensation, Cisco offers a salary range of $194,600.00 to $285,700.00 for this position in the U.S. and/or Canada, not including incentive compensation, equity, or benefits. Benefits include medical, dental and vision insurance, a 401(k) plan with a Cisco matching contribution, paid parental leave, short and long-term disability coverage, and basic life insurance.