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From the employer's careers site First seen 3 Nov 2026

Senior Principal Mechanical Engineer

Salary

Annual Salary USD 153,500 - 310,500

Apply on Hewlett Packard Enterprise

Description

As a Senior Principal Mechanical Engineer at Hewlett Packard Enterprise, you will lead the mechanical development of complex networking systems and chassis platforms from concept through production release and field support.

Responsibilities include:

  • Leading the mechanical development of complex networking systems and chassis platforms
  • Providing technical leadership across multiple programs and serving as a subject matter expert for mechanical architecture, packaging, manufacturability, reliability, and serviceability
  • Evaluating and integrating new technologies in cooling, liquid cooling, interconnects, materials, and manufacturing processes
  • Driving system-level technical decisions, balancing performance, cost, schedule, reliability, manufacturability, compliance, and customer requirements
  • Remaining actively engaged in hands-on engineering activities, including CAD reviews, tolerance analysis, prototype evaluation, laboratory testing, failure analysis, and root-cause investigations
  • Leading cross-functional design reviews and collaborating closely with Electrical, Thermal, Signal Integrity, Reliability, Manufacturing, Operations, and Supply Chain teams
  • Driving technical content of system specifications, design guidelines, validation plans, and engineering standards
  • Developing and maintaining mechanical design standards, best practices, and engineering methodologies across the organization
  • Identifying technical risks and driving mitigation plans throughout the product development lifecycle
  • Supporting customer escalations, manufacturing issues, and field failures through hands-on troubleshooting and corrective action development
  • Leading supplier engagements involving design reviews, manufacturing readiness, tooling strategies, and technical issue resolution
  • Providing project scoping, resource estimates, schedule input, and technical guidance for new product development efforts
  • Mentoring and developing engineers through technical coaching, design reviews, and day-to-day engineering leadership
  • Contributing to long-term technology planning and future platform development initiatives

The ideal candidate has a BS in Mechanical Engineering or equivalent and 12+ years of experience in electromechanical product development.

We offer a comprehensive suite of benefits that supports the physical, financial, and emotional wellbeing of our team members and their loved ones.

Skills

Required

  • 3D solid modeling tools
  • EPDM or equivalent PLM systems
  • tolerance analysis
  • GD&T
  • stack-up analysis
  • structural analysis techniques
  • FEA
  • ECAD-MCAD integration
  • IDF workflows
  • sheet metal design
  • machining
  • castings
  • extrusions
  • plastics
  • tooling requirements
  • manufacturing considerations
  • thermal design principles
  • thermal characterization
  • advanced cooling technologies
  • liquid cooling
  • NEBS
  • EMI
  • EMC
  • Safety
  • regulatory compliance requirements

Nice to have

  • MS in Mechanical Engineering or equivalent
  • Experience developing networking, server, storage, telecommunications, or high-performance computing systems
  • Extensive experience with chassis development, system packaging, and high-density electronic assemblies
  • Experience with advanced cooling technologies, including liquid cooling solutions
  • Demonstrated leadership of complex cross-functional development programs
Apply on Hewlett Packard Enterprise