Senior Packaging Technical Engineer - Hardware

Today, we're tapping into the unlimited potential of AI to define the next era of computing. An era in which our GPU acts as the brains of computers, robots, and self-driving cars that can understand the world.

As a Senior Packaging Technical Engineer - Hardware, you will play a key role in driving technology across multiple functions. You will be responsible for crafting and implementing silicon pad rings, as well as working with a variety of package technology types and complex technologies.

Responsibilities:

• Define and implement the chip pad ring, substrate interconnect scheme, and lead the package layout design process.
• Collaborate with large teams consisting of Circuit, Signal Integrity, RTL, Place and Route, substrate layout and system design Engineers and Managers.
• Work to define a chip floor plan, pad ring, substrate, and ball out implementing a robust world-class electrical package.
• Communicate effectively with various teams throughout the company.

Requirements:

• BSEE or equivalent experience.
• Minimum of 8+ years in board/system design. Experience with package design is preferred.
• Good understanding of transmission line theory, power delivery and signal integrity is desired.
• Programming and scripting skills in Perl, Python, Tcl desired, Cadence Skill and EXCEL familiarity are useful and a plus.
• Hardworking and able to work with a minimum of supervision.
• You seek to solve complex technical problems.

NVIDIA offers highly competitive salaries and a comprehensive benefits package. You will also be eligible for equity and benefits.