Description
We are seeking an experienced packaging, technology, and manufacturability expert to help us build the next generation of networking products. As a Packaging and Manufacturability Lead, you will own the package technical view across our chip programs, partnering with the advanced technology group to push technology limits in future products.
Key Responsibilities:
- Lead the technical assessment of package risk across our chip programs, identifying failure modes in substrate, interposer, and assembly integration before they reach silicon
- Drive new approaches to manufacturability across the board, spanning yield improvement, capacity and supply review, test strategy, thermal and assembly process maturity
- Analyze module yield mechanics, reconcile predicted versus actual yield on units returning from assembly, and convert the findings into concrete design guidance
- Evaluate emerging packaging and photonics technologies, including outside partner solutions, and define our product requirements
Requirements:
- B.S or M.S. in Electrical Engineering, Mechanical Engineering, Materials Science or equivalent experience
- More than 15 years of experience in package technology development or system integration, with multiple products carried through assembly
- Deep understanding of 2.5D, chiplet, and organic substrate integration
- Strong analytic capabilities, and passion for solving demanding technical problems
- Ability to drive complex activities involving many interfaces and teams, and to hold a technical position across organizations
Nice to Have:
- Hands-on experience on an assembly floor, a foundry, or at an OSAT
- Experience with co-packaged optics, photonic packaging, or fiber and laser attach
- Proven experience driving design-for-manufacturability into early architecture decisions
- Familiar with working on large high-end ASICs and multi-die modules
NVIDIA offers highly competitive salaries and a comprehensive benefits package.