Description
As a Senior Package Engineer at NVIDIA, you will work closely with SI, layout, and ASIC design teams to develop complex, top-of-the-line ASIC packages.
Responsibilities:
- Lead adhesive and bonding process development for advanced FCBGA packaging, including surface preparation, surface coatings, and process optimization for applications requiring optical alignment and high dimensional stability.
- Design and execute Design of Experiments (DOE) for adhesive material qualification, process window definition, and process optimization including failure analysis.
- Evaluate and qualify new materials (adhesives, encapsulants, underfills) from vendors including characterization of cure chemistry, thermal stability, and mechanical properties.
- Define and own incoming material acceptance criteria and statistical process control (SPC) thresholds for production readiness.
- Collaborate with partners and material suppliers to resolve process escapes, drive 8D corrective actions, and align on specification requirements.
- Prepare process documentation, assembly specs, and material qualification reports.
- Monitor and analyze production data to identify process trends, drive yield improvements, and ensure ongoing process control across OSAT manufacturing sites.
Requirements:
- B.Sc. or M.Sc. in Materials Science, Chemical Engineering, or a related field.
- 7+ years of experience in process engineering, with hands-on expertise in adhesive process development.
- Proven experience with failure analysis techniques: cross-sectioning, SEM/EDX, optical microscopy, DSC, TGA, and FTIR.
- Willingness and ability to travel internationally approximately 30% of the time to support OSAT partners, supplier qualifications, and on-site failure investigations.
- Ability to work independently in a fast-paced, multi-program environment.
- Curious and creative problem solver as well as organized and multi-tasker.
- Team oriented, able to move and motivate peers. Strong interpersonal skills (verbal and written).
- High awareness of quality, manufacturability, and project schedule.
Nice to Have:
- Proven record in packaging development.
- Background in semiconductor manufacturing processes and optical systems.