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From the employer's careers site First seen 25 Oct 2026 · Still live on 31 Oct 2026

Mechanical/Hardware Engineer (Thermal)

Salary

$95,800 - $220,500 per year

Apply on Hewlett Packard Enterprise

Description

We are seeking a Mechanical/Hardware Engineer (Thermal) to join our team. As a global edge-to-cloud company, Hewlett Packard Enterprise helps companies connect, protect, analyze, and act on their data and applications. You will primarily work from an HPE office and contribute to designing, analyzing, developing, modifying, and evaluating materials, mechanical systems, equipment, and packaging.

Responsibilities

  • Lead multiple project teams of mechanical hardware engineers and internal and outsourced development partners for complex products and platforms
  • Manage and expand relationships with internal and outsourced development partners on mechanical and thermal design and development
  • Review and evaluate designs and project activities for compliance with technology and development guidelines and standards
  • Provide domain-specific expertise and overall mechanical/thermal leadership and perspective to cross-organization projects, programs, and activities
  • Drive innovation and integration of new technologies into projects and activities in the mechanical and thermal design organization
  • Provide guidance and mentoring to less-experienced staff members
  • Communicate well verbally, in writing, and graphically
  • Work independently and as part of a team

Education and Experience Required

  • Bachelor's or Master's degree in Mechanical Engineering
  • Typically 4-6 years of experience

Knowledge and Skills

  • Proficiency with ProEngineer, Solidworks, or other 3D CAD software as a mechanical design tool
  • Strong analytical and problem-solving skills
  • Strong understanding and experience in electronics packaging
  • Designing sheet metal and plastic parts and associated production tooling and processes
  • Using CFD and thermal mockups to validate thermal solution
  • Excellent written and verbal communication skills; mastery in English and local language
  • Ability to effectively communicate product architectures, design proposals, and negotiate options at management levels

Benefits

  • Comprehensive suite of benefits that supports physical, financial, and emotional wellbeing
  • Investment in your career with programs catered to helping you reach your career goals
  • Unconditional inclusion and celebration of individual uniqueness

Salary

The expected salary/wage range for this position is $95,800 - $220,500 per year in Wisconsin.

Skills

Required

  • ProEngineer
  • Solidworks
  • 3D CAD software
  • electronics packaging
  • CFD
  • thermal mockups
  • analytical and problem-solving skills
Apply on Hewlett Packard Enterprise