Principal R&D Engineer (3DIC)

We are seeking a Principal R&D Engineer (3DIC) to join our team at Synopsys in Noida, Uttar Pradesh, India.

As a Principal R&D Engineer, you will contribute to package substrate design automation within the 3DIC Compiler platform, enabling advanced multi-die systems for AI, high-performance computing, and heterogeneous integration.

Key Responsibilities:

• Implement and extend package substrate design automation capabilities within the 3DIC Compiler platform.
• Write production C/C++ code for features such as HDI substrate auto-routing, design rule checking, power delivery network analysis, and design for manufacturability.
• Build, test, and debug software that runs on large, real-world packaging designs, including multi-die chiplets and heterogeneous integration.
• Collaborate with senior engineers, product teams, and customers to understand design bottlenecks and develop well-scoped software changes.
• Participate in design and code reviews, learning how architecture decisions are made across the 3DIC product.
• Grow your skills in algorithms, performance, and software quality under the mentorship of experienced R&D engineers.

The Impact You Will Have:

• Contribute features that help customers design next-generation advanced packaging for AI, high-performance computing, and other complex systems.
• Help reduce design cycle time for teams working on HDI substrates, chiplets, and multi-die architectures.
• Own well-defined pieces of auto-routing, power delivery, checking, and manufacturability software , and see them used by leading semiconductor companies.
• Build a foundation in a strategic Synopsys product line at the center of the industry shift toward chiplet-based systems.

Requirements:

• Bachelor’s or Master’s degree in Computer Science, Electrical Engineering, or a related field.
• 15+ years of relevant software or R&D experience.
• Strong C/C++ skills and a solid grasp of data structures, algorithms, and complexity.
• Ability to write, debug, and test production-quality code.
• Interest in physical design, EDA, semiconductors, or advanced packaging , prior domain experience is a plus.

Benefits:

• Comprehensive medical and healthcare plans.
• Time away programs, including ETO and FTO.
• Family support, including maternity and paternity leave, parenting resources, adoption and surrogacy assistance.
• ESPP: purchase Synopsys common stock at a 15% discount.
• Retirement plans that vary by region and country.
• Competitive salaries.