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From the employer's careers site First seen 26 Oct 2026

Signal and Power Integrity Engineer

Cisco San Jose, CA Hybrid senior full-time

Salary

$155,000 to $222,600 per year

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Description

We are seeking a qualified Signal and Power Integrity Engineer to help us develop our next generation ASIC packaging. You will define, design and verify ASIC packaging to be deployed in a range of Cisco platforms.

Responsibilities:

  • Develop, document, and implement design rules for ultra-high-speed signaling, ensuring power, performance, and area goals are met for products.
  • Analyze substrate signal integrity (SI) and power integrity (PI), providing feedback and collaborating with the layout team to develop optimal solutions across interposer, substrate, and PCB.
  • Design, document, and develop ASIC packages for high-volume, high-quality release, including post-layout extraction and reporting.
  • Collaborate with system partners, vendors, and design leads to achieve combined power and signal integrity and to resolve complex technical issues using advanced technology design rules.

Minimum Qualifications:

  • Bachelor's degree in Electrical Engineering and 4+ years of relevant signal and power integrity experience, or Master's degree in Electrical Engineering and 2+ years of relevant signal and power integrity experience, or PhD in Electrical Engineering and 0+ years of related experience.
  • Experience with high-speed design principles, including Transmission Line Theory, electromagnetics, scattering parameters, and impedance network analysis.
  • Experience with pre- and post-layout signal and power integrity (SI/PI) simulations using industry-standard EDA tools such as Cadence Sigrity, Ansys HFSS, and Keysight ADS.
  • Experience conducting detailed layout reviews and physical design validation using tools such as Cadence APD and Ansys EM flows.
  • Experience with SPICE for circuit-level analysis, signal modeling, and performance validation.

Preferred Qualifications:

  • Experience with articulating ideas and technical concepts to diverse audiences, both verbally and in writing.
  • Experience with high-bandwidth memory (HBM) or high-speed memory interface SI.
  • Experience with die-to-die interfaces (UCIe or proprietary).
  • Experience with advanced packaging (CoWoS, EMIB, interposer-based designs), including SI/PI analysis of 2.5D ASIC packaging.
  • Experience with Vector Network Analysis.
  • Experience with IBIS.

Benefits:

  • Medical, dental and vision insurance
  • 401(k) plan with a Cisco matching contribution
  • Paid parental leave
  • Short and long-term disability coverage
  • Basic life insurance
  • Paid time away (10 paid holidays per full calendar year, plus 1 floating holiday for non-exempt employees)
  • Flexible vacation time off program
  • 80 hours of sick time off provided on hire date and each January 1st thereafter

Skills

Required

Nice to have

  • High-Bandwidth Memory
  • Die-to-Die Interfaces
  • Advanced Packaging
  • Vector Network Analysis
  • IBIS
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