Principle Applications Engineer, 3DIC SI PI

We are seeking a Principle Applications Engineer, 3DIC SI PI at Synopsys. As a leader in engineering solutions, Synopsys enables customers to rapidly innovate AI-powered products. You will work with customers who are solving some of the hardest problems in semiconductor design, and what you show them will directly influence whether they can ship on time.

Responsibilities

• Engage directly with new and existing customers to understand their signal integrity, power integrity, and advanced packaging challenges, then demonstrate how Synopsys tools solve them in their specific design context
• Run multi-physics simulations using HFSS, SIwave, Q3D, Ansys, Clarity, or similar tools to validate product performance and guide customer evaluations
• Provide technical support and troubleshooting for customers working on 3D IC and advanced packaging designs, helping them set up models, interpret results, and optimize workflows
• Collaborate with product management and R&D teams to feed customer insights back into the roadmap and help prioritize feature development
• Travel to customer sites to conduct onsite evaluations, training sessions, and technical reviews, roughly 25% of the time
• Build and deliver technical presentations, application notes, and proof-of-concept demos that show measurable value in real customer scenarios
• Stay current on signal integrity, power integrity, and thermal analysis trends in advanced packaging and communicate those insights internally and externally

The Impact You Will Have

• You will directly influence whether customers adopt Synopsys tools by showing them how to solve problems they could not solve before
• Your simulations and technical guidance will help customers catch design issues earlier, reducing costly respins and time to market
• The feedback you bring back from the field will shape product priorities and feature development, making the tools better for the next customer
• You will expand Synopsys footprint in advanced packaging by proving value in 3D IC, chiplet, and heterogeneous integration designs
• Your technical credibility will build long-term customer relationships that lead to broader tool adoption and renewals
• You will help customers navigate complex tradeoffs in signal integrity, power delivery, and thermal management, enabling them to ship more reliable products
• The evaluations and demos you run will become case studies and reference designs that accelerate adoption across other accounts

Requirements

• Minimum 2 years of hands-on experience in 3D IC and advanced packaging design or analysis
• Proficiency with at least one of the following: HFSS, SIwave, Q3D, Ansys, or Clarity, with the ability to set up, run, and interpret multi-physics simulations
• Strong working knowledge of signal integrity and power integrity principles, including transmission line effects, crosstalk, PDN analysis, and resonance
• Demonstrated ability to work directly with customers, whether in evaluations, support, or training contexts
• Willingness and ability to travel to customer sites approximately 25% of the time
• Bachelor's or Master's degree in Electrical Engineering, Electronics Engineering, or a related field
• Experience with thermal or electrothermal analysis is a plus and will broaden the range of problems you can help customers solve