Description
We are looking for a Senior Signal Integrity & PCB Quality Engineer!
NVIDIA is powering the next wave of AI and accelerated computing, and our PCB technology is a critical enabler of the world's highest-performance systems. Join our SI team to ensure that every board we ship meets the most demanding signal integrity requirements , from early material research through high-volume manufacturing. You'll work at the intersection of electrical design, PCB fabrication science, and supplier quality, directly impacting products like DGX, MGX, and next-generation GPU/networking platforms.
If you love solving complex signal integrity challenges and thrive on bridging the gap between design intent and manufacturing reality, we want to hear from you.
Responsibilities:
- Define board and system level SI requirements with emphasis on PCB impedance control, insertion loss budgets, and high-speed channel performance
- Lead SI/PI design activities including PCB stackup definition, laminate/prepreg material selection, via impedance optimization, and design review
- Evaluate and qualify new PCB materials through characterization test vehicles, analyzing Dk, Df, surface roughness, and copper foil properties across frequency
- Collaborate with PCB fabrication suppliers to establish and monitor SI quality metrics , including trace geometry (H1/H2/W/T), impedance, and insertion loss , for both NPI and mass production builds
- Develop and maintain statistical process control frameworks for PCB fab impedance and IL data; identify trends, excursions, and root causes
- Conduct PCB supplier audits to verify process capability, compliance with NVIDIA specifications, and continuous improvement initiatives
- Partner with cross-functional teams (layout, mechanical, reliability, procurement) to balance SI performance with manufacturing feasibility, cost, and reliability
- Contribute to PCB technology roadmap development, evaluating emerging materials and fabrication processes for next-generation products
Requirements:
- BS or MS in Electrical Engineering, Materials Science, Chemical Engineering, or a related field, with 5+ years of relevant experience in PCB SI or PCB fabrication
- Strong foundation in electromagnetics, transmission line theory, and high-frequency signal propagation (skin effect, dielectric loss, dispersion)
- Experience with 3D/2D EM simulation tools such as HFSS, Q2D, Ansys SIwave, or Polar impedance calculators
- Hands-on experience with lab measurement equipment including VNA and TDR for impedance and insertion loss characterization
- Working knowledge of PCB fabrication processes: lamination, etching, plating, drilling, and their impact on electrical performance
- Ability to analyze data, identify trends, and communicate findings clearly to both technical and non-technical stakeholders
- Effective written and verbal communication skills in English
Nice to Have:
- Experience with advanced PCB materials and technologies (e.g., PTFE/HC laminates, HVLP4/5 copper foil, TLPS, embedded capacitors)
- Proficiency in Python, MATLAB, JMP, or similar tools for data analysis, automation, and statistical process monitoring
- Familiarity with Delta-L or other de-embedding methodologies for material characterization
- Experience managing supplier quality programs, including audit planning, corrective action tracking, and process capability studies
- Knowledge of IPC standards relevant to PCB fabrication and testing. Track record of driving PCB technology improvements from R&D through high-volume manufacturing